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Datasheet IDT74FCT163827B Equivalent ( PDF ) |
| N.º | Número de pieza | Descripción | Fabricantes | |
| 4 | IDT74FCT163827B | 3.3V CMOS 20-BIT BUFFERS 3.3V CMOS 20-BIT BUFFERS
Integrated Device Technology, Inc.
IDT74FCT163827A/B/C
FEATURES:
• 0.5 MICRON CMOS Technology • Typical tSK(o) (Output Skew) < 250ps • ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) • Packages include 25 mil pitch SSOP, 19.6 |
 Integrated Device Technology |
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| 3 | IDT74FCT163827BPA | 3.3V CMOS 20-BIT BUFFERS 3.3V CMOS 20-BIT BUFFERS
Integrated Device Technology, Inc.
IDT74FCT163827A/B/C
FEATURES:
• 0.5 MICRON CMOS Technology • Typical tSK(o) (Output Skew) < 250ps • ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) • Packages include 25 mil pitch SSOP, 19.6 |
Integrated Device Technology |
|
| 2 | IDT74FCT163827BPF | 3.3V CMOS 20-BIT BUFFERS 3.3V CMOS 20-BIT BUFFERS
Integrated Device Technology, Inc.
IDT74FCT163827A/B/C
FEATURES:
• 0.5 MICRON CMOS Technology • Typical tSK(o) (Output Skew) < 250ps • ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) • Packages include 25 mil pitch SSOP, 19.6 |
Integrated Device Technology |
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| 1 | IDT74FCT163827BPV | 3.3V CMOS 20-BIT BUFFERS 3.3V CMOS 20-BIT BUFFERS
Integrated Device Technology, Inc.
IDT74FCT163827A/B/C
FEATURES:
• 0.5 MICRON CMOS Technology • Typical tSK(o) (Output Skew) < 250ps • ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) • Packages include 25 mil pitch SSOP, 19.6 |
Integrated Device Technology |
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