Datasheet CIM05F221 Equivalent ( PDF )

N.º	Número de pieza	Descripción	Fabricantes	PDF
1	CIM05F221	Chip Bead Chip Bead ; CIB/CIM Series For EMI Suppression Feature Smallest beads suitable for surface mounting Perfect shape for automatic mounting, with no directionality. Excellent solderability and high heat resistance for either flow or reflow soldering. Monolithic inorganic material construction for hig	Samsung

CIM05F Datasheet ( Hoja de datos ) - resultados coincidentes

Número de pieza	Descripción	Fabricantes	PDF
CIM05F750	Chip Bead Chip Bead ; CIB/CIM Series For EMI Suppression Feature Smallest beads suitable for surface mounting Perfect shape for automatic mounting, with no directionality. Excellent solderability and high heat resistance for either flow or reflow soldering. Monolithic inorganic material	Samsung
CIM05F470	Chip Bead Chip Bead ; CIB/CIM Series For EMI Suppression Feature Smallest beads suitable for surface mounting Perfect shape for automatic mounting, with no directionality. Excellent solderability and high heat resistance for either flow or reflow soldering. Monolithic inorganic material	Samsung
CIM05F221	Chip Bead Chip Bead ; CIB/CIM Series For EMI Suppression Feature Smallest beads suitable for surface mounting Perfect shape for automatic mounting, with no directionality. Excellent solderability and high heat resistance for either flow or reflow soldering. Monolithic inorganic material	Samsung

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Número de pieza	Descripción	Fabricantes	PDF
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