B-03B-XASK-1 Datasheet ( Hoja de datos ) - DataSheet.es

B-03B-XASK-1 Datasheet ( Hoja de datos )


B-03B-XASK-1 Datasheet ( PDF )

N.º Número de pieza Descripción Fabricantes PDF
4 B-03B-XASK-1  B-03B-XASK-1 Hoja de datos PDF - JST

Connector


Crimp XA CONNECTOR Disconnectable Crimp style connectors • Locking device process or of vibration. Emboss Tape Radial Tape 2.5mm (.098") pitch Features –––––––––––––––––––––––– The housing has a locking device to securely hold the header, preventing accidental disconnection because of external forces that might result from the routing of wires during assembly • Solder crack preventive material Header wafer is made of g
JST
JST
PDF
3 B-03B-XASK-1-A  B-03B-XASK-1-A Hoja de datos PDF - JST

Connector


Crimp XA CONNECTOR Disconnectable Crimp style connectors • Locking device process or of vibration. Emboss Tape Radial Tape 2.5mm (.098") pitch Features –––––––––––––––––––––––– The housing has a locking device to securely hold the header, preventing accidental disconnection because of external forces that might result from the routing of wires during assembly • Solder crack preventive material Header wafer is made of g
JST
JST
PDF
2 B-03B-XASK-1N  B-03B-XASK-1N Hoja de datos PDF - JST

Connector


Crimp XA CONNECTOR Disconnectable Crimp style connectors • Locking device process or of vibration. Emboss Tape Radial Tape 2.5mm (.098") pitch Features –––––––––––––––––––––––– The housing has a locking device to securely hold the header, preventing accidental disconnection because of external forces that might result from the routing of wires during assembly • Solder crack preventive material Header wafer is made of g
JST
JST
PDF
1 B-03B-XASK-1N-A  B-03B-XASK-1N-A Hoja de datos PDF - JST

Connector


Crimp XA CONNECTOR Disconnectable Crimp style connectors • Locking device process or of vibration. Emboss Tape Radial Tape 2.5mm (.098") pitch Features –––––––––––––––––––––––– The housing has a locking device to securely hold the header, preventing accidental disconnection because of external forces that might result from the routing of wires during assembly • Solder crack preventive material Header wafer is made of g
JST
JST
PDF




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