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PDF MASW-004103-1365 Data sheet ( Hoja de datos )
| Número de pieza | MASW-004103-1365 | |
| Descripción | Silicon SP4T Surface Mount HMIC PIN Diode Switch | |
| Fabricantes | MA-COM | |
| Logotipo |  |
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MASW-004103-1365
Silicon SP4T Surface Mount HMIC PIN Diode Switch
50 MHZ - 20 GHz
Rev. V5
Features
Operates 50 MHz to 20 GHz
Usable up to 26 GHz
Low Insertion Loss
High Isolation
Low Parasitic Capacitance and Inductance
RoHS Compliant Surmount Package
Rugged, Fully Monolithic
Glass Encapsulated Construction
Up to +38 dBm C.W. Power Handling @ +25°C
Silicon Nitride Passivation
Polymer Scratch Protection
Solderable
Functional Schematic
Description
The MASW-004103-1365 is a SP4T, surmount,
broadband, monolithic switch using four sets of
series and shunt connected PIN diodes. This device
is designed for use in broadband, low to moderate
signal, high performance, switch applications up to
20 GHz. It is a surface mountable switch configured
for optimized performance and offers a distinct
advantage over MMIC, beamlead and chip and wire
hybrid designs. Because the PIN diodes of the
MASW-004103-1365 are integrated into the chip
and kept within close proximity, the parasitics
typically associated with other designs that use
individual components are kept to a minimum.
To minimize the parasitics and achieve high
performance the MASW-004103-1365 is fabricated
using MACOMs’ patented HMIC™ (Heterolithic
Microwave Integrated Circuit) process. This process
allows the silicon pedestals, which form the series
and shunt diodes or vias, to be imbeded in low loss,
low dispersion glass. The combination of low loss
glass and using tight spacing between elements
results in an HMIC device with low loss and high
isolation through low millimeter wave frequencies.
The topside is fully encapsulated with silicon nitride
and also has an additional layer of polymer for
scratch and impact protection. The protective
coating guards against damage to the junction and
the anode airbridges during handling and assembly.
On the backside of the chip gold metalized pads
have been added to produce a solderable surmount
device.
J3 J4
J2 J5
J1
Pin Configuration
Pin Function
J1 RFC
J2 RF1
J3 RF2
J4 RF3
J5 RF4
Ordering Information
Part Number
MASW-004103-13650G
Package
50 piece gel pack
MASW-004103-13655P
500 piece reel
MASW-004103-13650P
3000 piece reel
MASW-004103-001SMB
Sample Test Board
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
1 page  
MASW-004103-1365
Silicon SP4T Surface Mount HMIC PIN Diode Switch
50 MHZ - 20 GHz
Outline Drawing and Footprint (All dimensions in µm)
Rev. V5
DC & RF GND
1) Bottom view shows the back metal foot print and mounting pads.
2) All dimension are +/-0.5 µm.
3) Ground radius is 200 µm and centered on the I/O Pad.
4) The center pad shown on the chip bottom view must be connected to RF and DC ground
DIM
Width
Length
Thickness
MASW-004103-1365
Inches
MIN MAX
0.06220
0.06417
0.08740
0.08937
0.00394
0.00591
mm
MIN MAX
1.580 1.630
2.220 2.270
0.100 0.150
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet MASW-004103-1365.PDF ] | |
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