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PDF S29GL256P Data sheet ( Hoja de datos )

Número de pieza S29GL256P
Descripción Page Flash
Fabricantes Cypress Semiconductor 
Logotipo Cypress Semiconductor Logotipo



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S29GL01GP
S29GL512P
S29GL256P
S29GL128P
1 Gbit, 512, 256, 128 Mbit, 3 V, Page Flash
with 90 nm MirrorBit Process Technology
General Description
The Spansion S29GL01G/512/256/128P are Mirrorbit® Flash products fabricated on 90 nm process technology. These devices
offer a fast page access time of 25 ns with a corresponding random access time as fast as 90 ns. They feature a Write Buffer that
allows a maximum of 32 words/64 bytes to be programmed in one operation, resulting in faster effective programming time than
standard programming algorithms. This makes these devices ideal for today’s embedded applications that require higher density,
better performance and lower power consumption.
Distinctive Characteristics
Single 3V read/program/erase (2.7-3.6 V)
Enhanced VersatileI/O™ control
– All input levels (address, control, and DQ input levels) and
outputs are determined by voltage on VIO input. VIO range is 1.65
to VCC
90 nm MirrorBit process technology
8-word/16-byte page read buffer
32-word/64-byte write buffer reduces overall programming time for
multiple-word updates
Secured Silicon Sector region
– 128-word/256-byte sector for permanent, secure identification
through an 8-word/16-byte random Electronic Serial Number
– Can be programmed and locked at the factory or by the
customer
Uniform 64 Kword/128 Kbyte Sector Architecture
– S29GL01GP: One thousand twenty-four sectors
– S29GL512P: Five hundred twelve sectors
– S29GL256P: Two hundred fifty-six sectors
– S29GL128P: One hundred twenty-eight sectors
100,000 erase cycles per sector typical
20-year data retention typical
Offered Packages
– 56-pin TSOP
– 64-ball Fortified BGA
Suspend and Resume commands for Program and Erase
operations
Write operation status bits indicate program and erase operation
completion
Unlock Bypass Program command to reduce programming time
Support for CFI (Common Flash Interface)
Persistent and Password methods of Advanced Sector Protection
WP#/ACC input
– Accelerates programming time (when VHH is applied) for greater
throughput during system production
– Protects first or last sector regardless of sector protection
settings
Hardware reset input (RESET#) resets device
Ready/Busy# output (RY/BY#) detects program or erase cycle
completion
Cypress Semiconductor Corporation • 198 Champion Court
Document Number: 002-00886 Rev. *A
• San Jose, CA 95134-1709 • 408-943-2600
Revised December 16, 2015

1 page




S29GL256P pdf
S29GL01GP
S29GL512P
S29GL256P
S29GL128P
Recommended Combinations
Recommended Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to
confirm availability of specific recommended combinations and to check on newly released combinations.
S29GL-P Valid Combinations
Base Part
Number
S29GL01GP
S29GL512P
S29GL128P,
S29GL256P
Speed
11
12
13
11
12
13
10
11
12
10
11
12
90
10, 11
11
90
10, 11
11
Package (2)(3)
TA (1), TF
FA (1), FF
TA (1), TF
FA (1), FF
TA (1), TF
FA (1), FF
Temperature (4)
I, C
I
I, C
I
I, C
I
I, C
I
I, C
I
I, C
I
Model Number
R1, R2
01, 02
V1, V2
R1, R2
01, 02
V1, V2
R1, R2
01, 02
V1, V2
R1, R2
01, 02
V1, V2
R1, R2
01, 02
V1, V2
R1, R2
01, 02
V1, V2
Notes
1. Contact a local sales representative for availability.
2. TSOP package marking omits packing type designator from ordering part number.
3. BGA package marking omits leading “S29” and packing type designator from ordering part number.
4. Operating Temperature range: I = Industrial (–40°C to +85°C)
C = Commercial (0°C to +85°C)
5. Type 0 is standard. Specify other options as required.
Packing Type (5)
0, 3
0, 2, 3
0, 3
0, 2, 3
0, 3
0, 2, 3
Document Number: 002-00886 Rev. *A
Page 5 of 82

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S29GL256P arduino
S29GL01GP
S29GL512P
S29GL256P
S29GL128P
PACKAGE
TS 56
JEDEC
MO-142 (B) EC
SYMBOL MIN. NOM.
MAX.
A --- --- 1.20
A1 0.05
---
0.15
A2 0.95 1.00 1.05
b1 0.17 0.20 0.23
b
0.17 0.22
0.27
c1 0.10 ---
0.16
c 0.10 ---
0.21
D
19.80 20.00
20.20
D1 18.30 18.40 18.50
E
13.90 14.00
14.10
e 0.50 BASIC
L
0.50 0.60
0.70
O 0˚ -
R 0.08 ---
0.20
N 56
NOTES:
1 CONTROLLING DIMENSIONS ARE IN MILLIMETERS (mm).
(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982.)
2 PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).
3 TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS
DEFINED AS THE PLANE OF CONTACT THAT IS MADE WHEN THE PACKAGE
LEADS ARE ALLOWED TO REST FREELY ON A FLAT HORIZONTAL SURFACE.
4 DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE
MOLD PROTUSION IS 0.15 mm PER SIDE.
5 DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE
DAMBAR PROTUSION SHALL BE 0.08 mm TOTAL IN EXCESS OF b
DIMENSION AT MAX MATERIAL CONDITION. MINIMUM SPACE BETWEEN
PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 mm.
6 THESE DIMESIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN
0.10 mm AND 0.25 mm FROM THE LEAD TIP.
7 LEAD COPLANARITY SHALL BE WITHIN 0.10 mm AS MEASURED FROM THE
SEATING PLANE.
8 DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
3160\38.10A
Document Number: 002-00886 Rev. *A
Page 11 of 82

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