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PDF GBJ1502 Data sheet ( Hoja de datos )

Número de pieza GBJ1502
Descripción GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIER
Fabricantes SEMTECH 
Logotipo SEMTECH Logotipo



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No Preview Available ! GBJ1502 Hoja de datos, Descripción, Manual

GBJ15005 THRU GBJ1510
GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIER
REVERSE VOLTAGE: 50 to 1000 V
FORWARD CURRENT: 15 A
Features
Glass passivated chip junction
Reliable low cost construction utilizing molded
plastic technique
Ideal for printed circuit board
Low reverse leakage current
Low forward voltage drop
High surge current capabiliy
Mechanical data
Case:Molded plastic, GBJ
Epoxy: UL 94V-0 rate flame retardant
Terminals: Leads solderable per MIL-STD-202
method 208 guaranteed
Mounting Position: Any
Absolute Maximum Ratings and Characteristics
Ratings at 25 OC ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or
inductive load. For capacitive load, derate current by 20%.
Parameter
Symbols
GBJ
15005
GBJ
1501
GBJ
1502
GBJ
1504
GBJ
1506
GBJ
1508
GBJ
1510
Units
Maximum Recurrent Peak Reverse Voltage
VRRM
50 100 200 400 600 800 1000 V
Maximum RMS Voltage
VRMS 35 70 140 280 420 560 700 V
Maximum DC Blocking Voltage
VDC 50 100 200 400 600 800 1000 V
Maximum Average Forward Rectified Current with
Heatsink at TC = 100 OC
I(AV)
15
A
Peak Forward Surge Current, 8.3 ms Single Half-Sine
-Wave superimposed on rated load (JEDEC Method)
IFSM
200
A
Maximum Forward Voltage at 7.5 A DC and 25 OC
VF
1.05 V
Maximum Reverse Current at TA = 25 OC
at Rated DC Blocking Voltage TA = 125 OC
IR
10
500
µA
Typical Junction Capacitance 1)
CJ 60 pF
Typical Thermal Resistance 2)
RθJC
0.8 OC/W
Operating and Storage Temperature Range
TJ,TS
-55 to +150
OC
1) Measured at 1 MHz and applied reverse voltage of 4 VDC.
2) Thermal resistance from junction to case with device mounted on 300 mm X 300 mm X 1.6 mm Cu plate
heatsink.
SEMTECH ELECTRONICS LTD.
(Subsidiary of Semtech International Holdings Limited, a company
listed on the Hong Kong Stock Exchange, Stock Code: 724)
R
Dated : 19/02/2006 H

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