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PDF P0402V05 Data sheet ( Hoja de datos )

Número de pieza P0402V05
Descripción ULTRA LOW CAPACITANCE ESD PROTECTION COMPONENT
Fabricantes Protek Devices 
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Only One Name Means ProTek’Tion™
ULTRA LOW CAPACITANCE ESD PROTECTION COMPONENT
P0402V Series
DESCRIPTION
The P0402V Series is an ultra low capacitance ESD component designed to protect very high-speed data interfaces. These devices have a typical capactiance of only
0.05pF (I/O to GND) and is compatible with the ESD immunity requirements of IEC61000-4-2.
FEATURES
Compatible with IEC 61000-4-2 (ESD): Air 15kV (Typical), 25kV(Max)
Compatible with IEC 61000-4-2 (ESD): Contact 8kV (Typical),
15kV(Max)
Low Leakage Current: 0.10µA
• Fast Response Time
Protects One Bidirectional Line
Ultra Low Capacitance: 0.15 pF (Typical)
RoHS Compliant
REACH Compliant
APPLICATIONS
HDMI
• DVI
• Display Port
Unified Display Interface (UDI)
Mobile Display Digital Interface (MDDI)
Gigabit Ethernet
USB2.0 & USB3.0
IEEE 1394 Interface
MECHANICAL CHARACTERISTICS
Molded Ceramic 0402 Package
Approximate Weight: 0.44 milligrams
Lead-Free Plating
Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
8mm Tape and Reel Per EIA Standard 481
Flammability Rating UL 94V-0
05392.R3 10/15
PIN CONFIGURATION
1
2
Page 1
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P0402V05 pdf
Only One Name Means ProTek’Tion™
SOLDER REFLOW INFORMATION
P0402V Series
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask Defined Pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.150mm
Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)
0.330mm Round
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance - Edge To Corner Ball
±50µm
Solder Ball Side Coplanarity
±20µm
Maximum Dwell Time Above Liquidous (183°C)
60 seconds
Soldering Maximum Temperature
270°C
REQUIREMENTS
Temperature:
Preheat timTTePP
for Lead-Free (Sn/Ag/Cu): 260-270°C
for Tin-Lead: 240-245°C
and temperature depends on solder paste
and
flux
activa-
tion temperature, component size, weight, surface area and plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
Maximum Solder Reflow
(35-53°C Above Maximum Solder Melt Temp)
TP Solder Melt
Ramp-Up
(Maximum Temp)
Ramp-Down
05392.R3 10/15
Preheat
(Stay Below Flux Activation Temp)
30-60 seconds
Ramp-Up
15 seconds
(Minimize)
Page 5
Solder-Time Ramp-Down
15-20 seconds
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