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PDF SODZ36A-SH Data sheet ( Hoja de datos )

Número de pieza SODZ36A-SH
Descripción GLASS PASSIVATED JUNCTION Zener voltage regulator diodes
Fabricantes Leshan Radio Company 
Logotipo Leshan Radio Company Logotipo



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No Preview Available ! SODZ36A-SH Hoja de datos, Descripción, Manual

SODZ ***A -SH Series
Feature
GLASS PASSIVATED JUNCTION Zener voltage regulator diodes
1.0 Watt Steady State
* 1 W SOD-123-FL
* Zener voltage regulator diodes
* Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
* We declare that the material of product
compliance with RoHS requirements.
* Guarding for over voltage protection
* High temperature soldering guaranteed:
260°C/10 seconds at terminals
* IEC61000-4-2 ESD Air Contact±15KV
* MSL: 1
Mechanical Data
Case: JEDEC SOD-123-FL/MINI SMA molded plastic
Terminals :Plated terminals, solderable per
MIL-STD-750,Method 2026
Polarity: Color band denoted cathode except Bipolar
Mounting Position: Any
Weight : Approximated 0.0155 gram
1.Electrical Characteristic
Ratings at 25°C ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
RATING
Steady State Power Dissipation at TL=75°C(Note1)
Z-current
Peak Forward Surge Current, 8.3ms Single Half Sine-
Wave Superimposed on Rated Load(JECED Method) (Note 2)
We declare that the material of product is
Haloggen free (green epoxy compound)
SYMBOL
PM(AV)
IZ
VALUE
1.0
PV/VZ
IFSM
40
UNITS
Watts
mA
Amps
Operating and Storage Temperature Range
TJ,TSTG
NOTES:
1. 8.0mm2 (.013mm thick) land areas
2. 8.3ms single half sine-wave, duty cycle= 4 pulses per minutes maximum.
-50 to +150
°C

1 page




SODZ36A-SH pdf
Reel packing
PACKAGE
REEL SIZE
SOD123-FL
7"
SODZ ***A -SH Series
REEL
(PCS)
3,000
COMPONENT
SPACING
(mm)
4.0
BOX
(pcs)
30,000
INNER BOX REEL DIA. CARTON SIZE
(mm)
(mm)
(mm)
183*183*123
178
382*262*387
CARTON
(PCS)
240,000
APPOX.
GROSS WEIGHT
(kg)
8.7
5.Suggested thermal profile for soldering process
1. Storage environment:Temperature=5~40℃ Humidity=55±25%
2. Reflow soldering of surface-mount device
3. Reflow soldering
Profile Feature
Average ramp-up rate(TL to TP)
Preheat
- Temperature Min(Tsmin)
- Temperature Max(Tsmax)
- Time(min to max)(ts)
Tsmax to TL
- Ramp-up Rate
Time maintained above:
- Temperature (TL)
- Time(tL)
Peak Temperature(TP)
Time within 5℃ of actual Peak
Temperature(TP)
Ramp-down Rate
Time 25℃ to Peak Temperature
Soldering Condition
<3℃/sec
150℃
200℃
60~120sec
<3sec
217℃
60-260sec
255 -0/+5℃
10~30sec
<6℃/sec
<6minutes

5 Page





SODZ36A-SH arduino
标题:
Power Diode SMD Package Packing Spec
DOC NO.: WI-258
Version: 5 Modification: 0
Page: 6
C. Label Content
LRC Label
P/N
Lot No.
Date code
Quantity
Two-dimension code
Manufacturing
it
`
Maker
lot: 140106049X: 140106---2014/1/6049----lot number:49Xproduct code
Environment Label
Halide-free Label
Green

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