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PDF TGA2620 Data sheet ( Hoja de datos )
| Número de pieza | TGA2620 | |
| Descripción | Driver Amplifier | |
| Fabricantes | TriQuint Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de TGA2620 (archivo pdf) en la parte inferior de esta página. Total 13 Páginas | ||
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Applications
Commercial and military radar
Communications
TGA2620
16 – 18GHz Driver Amplifier
Product Features
Frequency Range: 16 – 18GHz
PSAT: 19dBm
P1dB: 18dBm
Small Signal Gain: 20dB
Input Return Loss: 20dB
Output Return Loss: 25dB
Bias: VD = 6V, IDQ = 30mA, VG = -0.6V Typical
Chip Dimensions: 1.14 x 1.24 x 0.10 mm
Functional Block Diagram
23
14
General Description
TriQuint’s TGA2620 is a Ku-band MMIC driver amplifier
fabricated on TriQuint’s 0.15um GaAs pHEMT
production process. Operating from 16-18GHz, the
TGA2620 provides more than 19dBm saturated output
power, 18dBm P1dB and more than 20dB small signal
gain.
Fully matched to 50 ohms with integrated DC blocking
capacitors on both I/O ports allows for simple system
integration. The TGA2620 is an ideal choice for general
purpose amplification across both commercial and
military Ku-band platforms.
Lead-free and RoHS compliant.
Evaluation boards are available upon request.
Pad Configuration
Pad No.
1
2
3
4
Symbol
RF In
VG
VD
RF Out
Ordering Information
Part
TGA2620
ECCN Description
EAR99 16 – 18GHz Driver Amplifier
Preliminary Datasheet: Rev - 07-26-14
© 2014 TriQuint
- 1 of 13 -
Disclaimer: Subject to change without notice
www.triquint.com
1 page  
Typical Performance (Large Signal)
21 POUT vs. Frequency vs. VD
Temp. = +25°C
20
PIN = 2dBm
19
18
17
16 6V30mA
5V30mA
15
14
13
15
16 17 18
Frequency (GHz)
19
20
TGA2620
16 – 18GHz Driver Amplifier
21 POUT vs. Frequency vs. IDQ
Temp. = +25°C
20
19
18
17 6V25mA
16 6V30mA
15 6V35mA
14
13
15
PIN = 2dBm
16 17 18
Frequency (GHz)
19
20
POUT vs. Frequency vs. PIN
24
Temp. = +25°C
21
18
15
12
-2dBm
9 2dBm
6 5dBm
3
0
15
VD = 6V, IDQ = 30mA
16 17 18
Frequency (GHz)
19
20
POUT vs. Frequency
24
Temp. = +25°C
21
18
15
12
P3dB
9 P1dB
6
3
0
15
VD = 6V, IDQ = 30mA
16 17 18
Frequency (GHz)
19
20
Output Power vs. Frequency vs. Temp.
24
21 PIN = 2dBm
18
15
12
9 +25°C
+85°C
6
3
0
15
VD = 6V, IDQ = 30mA
16 17 18
Frequency (GHz)
19
20
40
35
30
25
20
15
10
5
0
15
PAE vs. Frequency vs. Temp.
PIN = 2dBm
+25°C
+85°C
16
VD = 6V, IDQ = 30mA
17 18
Frequency (GHz)
19
20
Preliminary Datasheet: Rev - 07-26-14
© 2014 TriQuint
- 5 of 13 -
Disclaimer: Subject to change without notice
www.triquint.com
5 Page 
Mechanical Drawing & Bond Pad Description
TGA2620
16 – 18GHz Driver Amplifier
23
1
4
Unit: millimeters
Thickness: 0.10
Die x, y size tolerance: +/- 0.050
Chip edge to bond pad dimensions are shown to center of pad
Ground is backside of die
Bond Pad
1
2
3
4
Symbol
RF In
VG
VD
RF Out
Pad Size
0.106 x 0.190
0.090 x 0.090
0.090 x 0.090
0.106 x 0.190
Description
Input; matched to 50 ohms; DC blocked.
Gate voltage, bias network is required; see Application Circuit on page 9
as an example.
Drain voltage, bias network is required; see Application Circuit on page 9
as an example.
Output; matched to 50 ohms; DC blocked.
Preliminary Datasheet: Rev - 07-26-14
© 2014 TriQuint
- 11 of 13 -
10 as an exampl
Disclaimer: Subject to change without notice
www.triquint.com
11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet TGA2620.PDF ] | |
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