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PDF USB3300 Data sheet ( Hoja de datos )

Número de pieza USB3300
Descripción Hi-Speed USB Host & Device or OTG PHY
Fabricantes Microchip 
Logotipo Microchip Logotipo



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No Preview Available ! USB3300 Hoja de datos, Descripción, Manual

USB3300
Hi-Speed USB Host, Device or OTG PHY with
ULPI Low Pin Interface
Product Features
• USB-IF Hi-Speed certified to the Universal Serial
Bus Specification Rev 2.0
• Interface compliant with the ULPI Specification
revision 1.1 in 8-bit mode
• Industry standard UTMI+ Low Pin Interface (ULPI)
Converts 54 UTMI+ signals into a standard 12 pin
Link controller interface
• 54.7mA Unconfigured Current (typical) - ideal for
bus powered applications
• 83uA suspend current (typical) - ideal for battery
powered applications
• Latch-Up performance exceeds 150 mA per EIA/
JESD 78, Class II
• ESD protection levels of ±8kV HBM without exter-
nal protection devices
• Integrated protection to withstand IEC61000-4-2
ESD tests (±8kV contact and ±15kV air) per 3rd
party test facility
• Supports FS pre-amble for FS hubs with a LS
device attached (UTMI+ Level 3)
• Supports HS SOF and LS keep-alive pulse
• Includes full support for the optional On-The-Go
(OTG) protocol detailed in the On-The-Go Sup-
plement Revision 1.0a specification
• Supports the OTG Host Negotiation Protocol
(HNP) and Session Request Protocol (SRP)
• Allows host to turn VBUS off to conserve battery
power in OTG applications
• Supports OTG monitoring of VBUS levels with
internal comparators. Includes support for an
external VBUS or fault monitor.
• Low Latency Hi-Speed Receiver (43 Hi-Speed
clocks Max) allows use of legacy UTMI Links with
a ULPI wrapper
• Integrated Pull-up resistor on STP for interface
protection allows a reliable Link/PHY start-up with
slow Links (software configured for low power)
• Internal 1.8 volt regulators allow operation from a
single 3.3 volt supply
• Internal short circuit protection of ID, DP and DM
lines to VBUS or ground
• Integrated 24MHz Crystal Oscillator supports
either crystal operation or 24MHz external clock
input
• Internal PLL for 480MHz Hi-Speed USB operation
• Industrial Operating Temperature -40°C to +85°C
• 32 pin, QFN RoHS Compliant package
(5 x 5 x 0.90 mm height)
Applications
The USB3300 is the ideal companion to any ASIC, SoC
or FPGA solution designed with a ULPI Hi-Speed USB
host, peripheral or OTG core.
The USB3300 is well suited for:
• Cell Phones
• PDAs
• MP3 Players
• Scanners
• External Hard Drives
• Digital Still and Video Cameras
• Portable Media Players
• Printers
2014-2015 Microchip Technology Inc.
DS00001783B-page 1

1 page




USB3300 pdf
USB3300
FIGURE 1-2:
ULPI INTERFACE FEATURES AS RELATED TO UTMI+
ULPI
Hi-Speed Peripheral, host controllers, On-the-
Go devices with 12 pin interface
(HS, FS, LS, preamble packet)
UTMI+ Level 3
Hi-Speed Peripheral, host controllers, On-
the-Go devices
(HS, FS, LS, preamble packet)
UTMI+ Level 2
Hi-Speed Peripheral, host controllers, On-
the-Go devices
(HS, FS, and LS but no preamble packet)
UTMI+ Level 1
Hi-Speed Peripheral, host controllers,
and On-the-Go devices
(HS and FS Only)
UTMI+ Level 0
Hi-Speed Peripherals Only
USB3300
USB3500
USB3450
USB3280
USB3250
1.2 Reference Documents
• Universal Serial Bus Specification, Revision 2.0, April 27, 2000
• On-The-Go Supplement to the USB 2.0 Specification, Revision 1.0a, June 24, 2003
• USB 2.0 Transceiver Macrocell Interface (UTMI) Specification, Version 1.02, May 27, 2000
• UTMI+ Specification, Revision 1.0, February 2, 2004
• UTMI+ Low Pin Interface (ULPI) Specification, Revision 1.1
2014-2015 Microchip Technology Inc.
DS00001783B-page 5

5 Page





USB3300 arduino
USB3300
4.0 OPERATIONAL DESCRIPTION
TABLE 4-1: MAXIMUM GUARANTEED RATINGS
Parameter
Symbol
Maximum VBUS, ID,
EXTVBUS, DP, and DM
voltage to GND
VMAX_5V
Maximum VDD1.8 and
VDDA1.8 voltage to
Ground
VMAX_1.8V
Maximum 3.3V supply
voltage to Ground
VMAX_3.3V
Maximum I/O voltage to
Ground
VMAX_IN
Operating Temperature
Storage Temperature
TMAX_OP
TMAX_STG
ESD PERFORMANCE
All Pins
VHBM
LATCH-UP PERFORMANCE
All Pins
ILTCH_UP
Condition
Human Body Model
EIA/JESD 78, Class II
MIN TYP
-0.5
MAX
+5.5
-0.5 2.5
-0.5 4.0
-0.5 4.0
-40 85
-55 150
±8
150
Units
V
V
V
V
°C
°C
kV
mA
Note: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
TABLE 4-2: RECOMMENDED OPERATING CONDITIONS
Parameter
VDD3.3 to GND
Input Voltage on Digital
Pins
Voltage on Analog I/O
Pins (DP, DM, ID)
VBUS to GND
Ambient Temperature
Symbol
VDD3.3
VI
VI(I/O)
VVBUS
TA
Condition
MIN
3.0
0.0
0.0
0.0
-40
TYP
3.3
MAX
3.6
VDD3.3
VDD3.3
5.25
85
Units
V
V
V
C
2014-2015 Microchip Technology Inc.
DS00001783B-page 11

11 Page







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