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PDF L88M05T Data sheet ( Hoja de datos )

Número de pieza L88M05T
Descripción Low Dropout Voltage Regulator
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No Preview Available ! L88M05T Hoja de datos, Descripción, Manual

Ordering number : EN5839C
L88M05T
Monolithic Linear IC
17V, 5V / 0.5A Low Dropout
Voltage Regulator
http://onsemi.com
Overview
The L88M05T is low dropout voltage regulator IC with output current of 0.5 A. Because they can operate with a low
input-output voltage difference, they contribute to smaller and more efficient set power supplies, and are optimum for
audio-visual and office automation equipment.
Functions
• Output voltage : 5V
• 500 mA output current
• Low minimum input-output voltage differential (0.4V typ) enables to save energy and miniaturize transformer size.
• Set size can be miniaturized with compact TP-3H power package.
• Surface mounting on board permits allowable power dissipation to be raised.
• Enhanced mount flexibility with range of formed products.
Specifications
Maximum Ratings at Ta = 25C
Parameter
Symbol
Input voltage
VIN max
Allowable power dissipation
Pd max
Thermal resistance (junction-atmosphere)
Thermal resistance (junction-to-case)
Operating temperature
Storage temperature
θj-a
θj-c
Topr
Tstg
Conditions
Ta 25°C, no heat sink
Tc = 25°C, with infinite heat sink
Ratings
18
1
6.25
125
20
20 to 85
55 to 150
Unit
V
W
W
C/W
C/W
C
C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
TP3H
ORDERING INFORMATION
See detailed ordering and shipping information on page 8 of this data sheet.
Semiconductor Components Industries, LLC, 2014
February, 2014
21414HK 20070312-S00010,20060913-S00002/D3098HA(II) No.5839-1/8

1 page




L88M05T pdf
L88M00T Series
Pd max – Ta
Common for L88M00T Series
With infinite heat sink
Mounted on copper-clad
area of 2,000 mm2
Mounted on copper-clad
area 740 mm2
Mounted on copper-clad
area 180 mm2
Mounted on copper-clad
area 36 mm2
No heat sink
Ambient temperature, Ta – °C
1) The allowable power dissipation is 1.0 W (Ta = 25°C) with no fin attached, but when mounted on a hybrid IC board or printed
circuit board, high allowable power dissipation is achieved, despite the compact package.
The graph below depicts the relationship between the copper-clad area and allowable power dissipation when mounted on a
glass epoxy board (50 × 5 0 × 0.8 tmm3) with a copper thickness of 18 μm.
Pd max – S
Common for L88M00T series
PCB
Copper-clad
area, S – (mm2)
Copper-clad area, S – mm2
2) Pd is the value for when the solder on the surface of the IC heat sink has melted completely and the surface mount is
horizontal.
3) Please be advised that the flow solder application system (full-heat method) cannot be recommended.
Lead Formings
LR forming
FA forming
No.5839-5/8

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