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PDF BAP50LX Data sheet ( Hoja de datos )
| Número de pieza | BAP50LX | |
| Descripción | Silicon PIN diode | |
| Fabricantes | NXP Semiconductors | |
| Logotipo |  |
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BAP50LX
Silicon PIN diode
Rev. 2 — 7 August 2013
Product data sheet
1. Product profile
1.1 General description
Planar PIN diode in a SOD882D leadless ultra small plastic SMD package.
1.2 Features and benefits
Low diode capacitance
Low diode forward resistance
For applications up to 3 GHz
1.3 Applications
General RF applications
2. Pinning information
Table 1.
Pin
1
2
Discrete pinning
Description
cathode
anode
Simplified outline Symbol
[1]
12
Transparent
top view
sym006
[1] The marking bar indicates the cathode.
3. Ordering information
Table 2. Ordering information
Type number Package
Name
Description
BAP50LX
DFN1006D-2 leadless ultra small plastic package; 2 terminals;
body 1 0.6 0.4 mm
Version
SOD882D
1 page  
NXP Semiconductors
8. Package outline
DFN1006D-2: Leadless ultra small plastic package; 2 terminals; body 1 x 0.6 x 0.4 mm
(2x)
L1
(2x)
wA
1 2b
(2x)
(2x)
wB
e
BAP50LX
Silicon PIN diode
SOD882D
y
E
A
A1
A
D
(2)
B
Dimensions
Unit A(1) A1 b D E e L1 w y
max 0.4 0.04 0.55 0.65 1.05
0.30 0.1 0.03
mm nom
0.50 0.60 1.00 0.65 0.25
min
0.45 0.55 0.95
0.22
Note
1. Dimension including plating thickness.
2. The marking bar indicates the cathode (if applicable).
Outline
version
References
IEC
JEDEC
JEITA
SOD882D
0
Fig 6. Package outline SOD882D (DFN1006D-2)
BAP50LX
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 August 2013
0.5
scale
European
projection
1 mm
sod882d_po
Issue date
10-09-27
12-05-01
© NXP B.V. 2013. All rights reserved.
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