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PDF EM3592 Data sheet ( Hoja de datos )

Número de pieza EM3592
Descripción Integrated ZigBee/802.15.4 System-on-Chip
Fabricantes Silicon Laboratories 
Logotipo Silicon Laboratories Logotipo



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EM359x
High-Performance, Integrated ZigBee/802.15.4 System-on-Chip Family
Complete System-on-Chip
- 32-bit ARM® Cortex -M3 processor
- 2.4 GHz IEEE 802.15.4-2003 transceiver & lower MAC
- 256 or 512 kB flash, with optional read protection
- 32 or 64 kB RAM memory
- AES128 encryption accelerator
- Flexible ADC, UART/SPI/TWI serial communications,
and general purpose timers
- Optional USB serial communications
- 32 highly configurable GPIOs with Schmitt trigger inputs
Industry-leading ARM® Cortex -M3 processor
- Leading 32-bit processing performance
- Highly efficient Thumb-2 instruction set
- Operation at 6, 12, or 24 MHz
- Flexible Nested Vectored Interrupt Controller
Low power consumption, advanced management
- RX Current (w/ CPU): 27 mA
- TX Current (w/ CPU, +3 dBm TX): 31 mA
- Low deep sleep current, with retained RAM and GPIO:
1.0 A without/1.25 A with sleep timer
- Low-frequency internal RC oscillator for low-power sleep
timing
- High-frequency internal RC oscillator for fast (110 µs)
processor start-up from sleep
Exceptional RF Performance
- Normal mode link budget up to 103 dB; configurable up
to 110 dB
- –100 dBm normal RX sensitivity; configurable to
–102 dBm (1% PER, 20 byte packet)
- +3 dB normal mode output power; configurable up to
+8 dBm
- Robust Wi-Fi and Bluetooth coexistence
Innovative network and processor debug
- Packet Trace Port for non-intrusive packet trace with
Ember development tools
- Serial Wire/JTAG interface
- Standard ARM debug capabilities: Flash Patch & Break-
point; Data Watchpoint & Trace; Instrumentation Trace
Macrocell
Application Flexibility
- Single voltage operation: 2.1–3.6 V with internal 1.8 and
1.25 V regulators
- Optional 32.768 kHz crystal for higher timer accuracy
- Low external component count with single 24 MHz
crystal
- Support for external power amplifier
- 8x8 mm 56-pin QFN package
RF_TX_ALT_P,N
RF_P,N
PA select
PA
PA
LNA
SYNTH
DAC
IF ADC
OSCA
OSCB
VDD_CORE
VREG_OUT
nRESET
Bias
HF crystal 
OSC
1.25V 
Regulator
1.8V 
Regulator
POR
LF crystal 
OSC
Internal HF
RC-OSC
Internal LF
RC-OSC
Calibration
ADC
USB
Device
General
Purpose
ADC
TX_ACTIVE
MAC
+
Baseband
Packet Trace
Data
RAM
32/64 kB
Program Flash
256/512 kB
ARM® CortexTM-M3
CPU with NVIC
and MPU
2nd level
Interrupt
controller
General 
purpose 
timers
GPIO
registers
CPU debug TPIU/
ITM/FPB/DWT/
ETM
Encryption 
acclerator
Always
Powered
Domain
Watchdog
Serial Wire
and JTAG
debug
SWCLK, JTCK 
UART/SPI/
TWI
Chip
manager
Sleep
timer
GPIO multiplexor switch
PA[7:0], PB[7:0], PC[7:0], PD[4:1], PE[3:0]
Rev 1.0 9/14
Copyright © 2014 by Silicon Laboratories
EM359x

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EM3592 pdf
EM359x
1. Related Documents and Conventions
1.1. Related Documents
This data sheet accompanies several documents to provide the complete description of the Ember EM359x
devices.
1.1.1. Ember EM359x Reference Manual
The Silicon Laboratories Ember EM359x Reference Manual provides the detailed description for each peripheral
on the EM359x devices.
1.1.2. ZigBee Specification
The core ZigBee specification (Document 053474) defines ZigBee's smart, cost-effective and energy-efficient
mesh network. It can be downloaded from the ZigBee website (www.zigbee.org). ZigBee Alliance membership is
required.
1.1.3. ZigBee PRO Stack Profile
The ZigBee PRO Stack Profile specification (Document 074855) is optimized for low power consumption and to
support large networks with thousands of devices. It can be downloaded from the ZigBee website (111.zigbee.org).
ZigBee Alliance membership is required.
1.1.4. ZigBee Stack Profile
The ZigBee Stack Profile specification (Document 064321) is designed to support smaller networks with hundreds
of devices in a single network. It can be downloaded from the ZigBee website (111.zigbee.org). ZigBee Alliance
membership is required.
1.1.5. Bluetooth Core Specification
The Bluetooth specification is the global short-range wireless standard enabling connectivity for a broad range of
electronic devices. Version 2.1 + EDR (Enhanced Data Rate) can be found here:
http://www.bluetooth.org/docman/handlers/downloaddoc.ashx?doc_id=241363
1.1.6. IEEE 802.15.4-2003
This standard defines the protocol and compatible interconnection for data communication devices using low data
rate, low power and low complexity, short-range radio frequency (RF) transmissions in a wireless personal area
network (WPAN). It can be found here:
IEEE 802.15.4-2003 (http://standards.ieee.org/getieee802/download/802.15.4-2003.pdf)
1.1.7. IEEE 802.11g
This version provides changes and additions to support the further higher data rate extension for operation in the
2.4 GHz band. It can be found here:
http://standards.ieee.org/getieee802/download/802.11g-2003.pdf
1.1.8. USB 2.0 Specification
The Universal Serial Bus Revision 2.0 specification provides the technical details to understand USB requirements
and design USB compatible products. The main specification (usb_20.pdf) is part of the zipfile found here:
http://www.usb.org/developers/docs/usb_20_101111.zip
1.1.9. ARM® Cortex™-M3 Reference Manual
ARM-specific features like the Nested Vector Interrupt Controller are described in the ARM® Cortex™-M3
reference documentation. The online reference manual can be found here:
http://infocenter.arm.com/help/topic/com.arm.doc.subset.cortexm.m3/index.html#cortexm3
Rev 1.0
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EM3592 arduino
EM359x
Table 2.1. Bill of Materials for Figure 2.1
Item Qty Reference
1 1 ANT1
2 1 BLN1
31
41
51
62
73
83
92
10 1
11 1
C1
C2
C3
C4, C14
C5, C12, C13
C6, C10, C11
C7, C9
C8
C15
12 3 D1, D2, D3
13 1
14 1
15 1
FB1
J1
J2
16 4
17 2
L1, L2, L3, L4
L5, L6
18 1
19 1
20 1
21 1
22 2
23 1
24 4
25 1
R1
R2
R3
R4
R5, R6
R7
R8, R9, R10, R11
Q1
26 1 U1
Description
Manufacturer
ANTENNA, <not specified>
<not specified>
BALUN, CHIP MULTILAYER CERAMIC, 2.4
GHZ. 50/100 OHM, -40C TO 85C, 0805
CAPACITOR, <not specified>
Wurth 748421245
Johanson 2450BL15B100E
Murata LDB212G4010C-001
TDK HHM1520
<not specified>
CAPACITOR, <not specified>
<not specified>
CAPACITOR, 2.2 µF, 10 V, X5R, 10%, 0603
<not specified>
CAPACITOR, 1 µF, 6.3 V, X5R, 10%, 0402
<not specified>
CAPACITOR, 33 pF, ±5%, 50 V, NPO, 0402
CAPACITOR, 22 pF, ±5%, 50 V, NPO, 0402
CAPACITOR, 1 pF, ±0.25 pF, 50 V, 0402, NPO
CAPACITOR, 1.8pF, ±0.25 pF, 50 V, 0402, NPO
<not specified>
<not specified>
<not specified>
<not specified>
CAPACITOR, 0.47µF, ±10%, 6.3 V, X5R, 0402
Murata
GRM155R60J474KE19D
DIODE, TVS, 45 W, 5 V, SOD-882
Vishay
VBUS051BD-HD1-GS08
FERRITE BEAD, 60 OHM, 500MA, 0603
CONNECTOR, USB, MICRO B, SMD
CONNECTOR, HEADER, SHROUDED, 10
POSITION, DUAL ROW, VERTICAL, 0.050"
Murata BLM18PG600SN1
FCI 10118192-0001LF
Samtec FTSH-105-01-L-DV-K
INDUCTOR, <not specified>
<not specified>
INDUCTOR, 2.7 nH, ±0.3 nH, 0402, MULTI-
LAYER
Murata LQG15HS2N7
RESISTOR, 100K OHM, 5%, 1/10W, 0402
RESISTOR, 150K OHM, 5%, 1/16W, 0402
RESISTOR, 1 OHM, 5%, 1/16W, 0402
<not specified>
<not specified>
<not specified>
RESISTOR, 1.5K OHM, 1%, 1/16W, 0402
<not specified>
RESISTOR, 33 OHM, 1%, 1/10W, 0402
<not specified>
RESISTOR, 10 OHM, 5%, 1/16W, 0402
<not specified>
RESISTOR, 100K OHM, 5%, 1/16W, 0402
<not specified>
MOSFET, 2N7002, 300MA, 830MW, 60V, TO-
236-3, SC-59, SOT-23-3
IC, VOLTAGE REGULATOR, <not specified>
NXP Semiconductor 2N7002
<not specified>
Rev 1.0
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