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PDF CHS2412-QDG Data sheet ( Hoja de datos )

Número de pieza CHS2412-QDG
Descripción GaAs Monolithic Microwave IC
Fabricantes United Monolithic Semiconductors 
Logotipo United Monolithic Semiconductors Logotipo



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CHS2412-QDG
23-26GHz Reflective SP4T Switch
GaAs Monolithic Microwave IC in SMD leadless package
Description
The CHS2412-QDG is a monolithic reflective
SP4T switch in K-Band. The CHS2412-QDG
is a dual source to the CHS2411-QDG: same
electrical performances, same Pin-out,
packaging and quality standard level.
The circuit is manufactured with a standard
pHEMT process, 0.5µm gate length, via
holes through the substrate and air bridges.
The circuit is packaged in a leadless plastic
plastic surface mount package. 24 Leads
RoHS compliant QFN4x4 package.
Functional Block Diagram
Main Features
Low insertion loss: 2.9dB Typ.
High isolation: 35dB Typ.
Fast switching time
Low consumption
High temperature range
Positive supply voltage
MSL1
24L-QFN 4x4 SMD Leadless package
UUMMSS
A2346168278A
YYWYWWWG
Plastic Package
Main Electrical Characteristics
Tamb.= +25°C
Symbol
Parameter
Freq Frequency range
IL Insrtion Loss
Iso Isolation
RLoss Return Loss.
Min Typ Max Unit
23 26 GHz
2.9 4 dB
32 35
dB
-15 dB
Ref. : DSCHS2412-QDG4120 - 30 Apr 14
1/10 Specifications subject to change without notice
United Monolithic Semiconductors S.A.S.
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34

1 page




CHS2412-QDG pdf
23-26GHz Reflective SP4T Switch
Package outline (1)
CHS2412-QDG
Matt tin, Lead Free
Units :
From the standard :
25-
(Green)
mm
JEDEC MO-220
(VGGD)
GND
1- Nc
2- P3
3- Gnd(2)
4- RFout4
5- Gnd(2)
6- Vd(3)
7- P4
8- Gnd(2)
9- RF in
10- Gnd(2)
11- Gnd(2)
12- P1
13- Vd(3)
14- Gnd(2)
15- RFout1
16- Gnd(2)
17- P2
18- Nc
19- Gnd(2)
20- RFout2
21- Gnd(2)
22- Gnd(2)
23- RFout3
24- Gnd(2)
(1) The package outline drawing included to this data-sheet is given for indication. Refer to the
application note AN0017 (http://www.ums-gaas.com) for exact package dimensions.
(2) It is strongly recommended to ground all pins marked “Gnd” through the PCB board.
Ensure that the PCB board is designed to provide the best possible ground to the package.
(3) Vd = +5V.
Ref. : DSCHS2412-QDG4120 - 30 Apr 14
5/10 Specifications subject to change without notice
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34

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