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PDF IPA60R230P6 Data sheet ( Hoja de datos )

Número de pieza IPA60R230P6
Descripción MOSFET ( Transistor )
Fabricantes Infineon 
Logotipo Infineon Logotipo



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No Preview Available ! IPA60R230P6 Hoja de datos, Descripción, Manual

MOSFET
MetalOxideSemiconductorFieldEffectTransistor
CoolMOS™P6
600VCoolMOS™P6PowerTransistor
IPx60R230P6
DataSheet
Rev.2.2
Final
PowerManagement&Multimarket

1 page




IPA60R230P6 pdf
600VCoolMOS™P6PowerTransistor
IPW60R230P6,IPB60R230P6,IPP60R230P6,
IPA60R230P6
3Thermalcharacteristics
Table3Thermalcharacteristics(NonFullPAK)TO-220,TO-247
Parameter
Symbol
Values
Unit Note/TestCondition
Min. Typ. Max.
Thermal resistance, junction - case RthJC
Thermal resistance, junction - ambient RthJA
- - 0.99 °C/W -
- - 62 °C/W leaded
Soldering temperature, wavesoldering
only allowed at leads
Tsold
- - 260 °C 1.6mm (0.063 in.) from case for 10s
Table4Thermalcharacteristics(FullPAK)TO-220FP
Parameter
Symbol
Values
Min. Typ. Max.
Thermal resistance, junction - case RthJC
- - 3.8
Thermal resistance, junction - ambient RthJA
- - 80
Soldering temperature, wavesoldering
only allowed at leads
Tsold
- - 260
Unit Note/TestCondition
°C/W -
°C/W leaded
°C 1.6mm (0.063 in.) from case for 10s
Table5ThermalcharacteristicsTO-263
Parameter
Symbol
Thermal resistance, junction - case RthJC
Thermal resistance, junction - ambient RthJA
Min.
-
-
Thermal resistance, junction - ambient
for SMD version
RthJA
-
Soldering temperature, wave & reflow
soldering allowed
Tsold
-
Values
Typ. Max.
- 0.99
- 62
35 45
- 260
Unit Note/TestCondition
°C/W -
°C/W device on PCB, minimal footprint
Device on 40mm*40mm*1.5mm
epoxy PCB FR4 with 6cm² (one
°C/W
layer, 70µm thickness) copper area
for drain connection and cooling.
PCB is vertical without air stream
cooling.
°C reflow MSL1
Final Data Sheet
5 Rev.2.2,2015-07-10

5 Page





IPA60R230P6 arduino
600VCoolMOS™P6PowerTransistor
IPW60R230P6,IPB60R230P6,IPP60R230P6,
IPA60R230P6
Diagram13:Typ.transfercharacteristics
50
45
40
35
30
25
20
15
10
5
0
0246
VGS[V]
ID=f(VGS);VDS=20V;parameter:Tj
8
Diagram14:Typ.gatecharge
10
25 °C
9
8
7
120 V
480 V
6
150 °C
5
4
3
2
1
10 12
0
0 5 10 15 20 25 30
Qgate[nC]
VGS=f(Qgate);ID=8.0Apulsed;parameter:VDD
35
Diagram15:Forwardcharacteristicsofreversediode
102
Diagram16:Avalancheenergy
400
350
101
125 °C
25 °C
300
250
200
150
100
100
50
10-1
0.0
0.5
IF=f(VSD);parameter:Tj
1.0
VSD[V]
1.5
0
2.0 25 50 75 100 125 150
Tj[°C]
EAS=f(Tj);ID=2.9A;VDD=50V
Final Data Sheet
11 Rev.2.2,2015-07-10

11 Page







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