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PDF IP4234CZ6 Data sheet ( Hoja de datos )

Número de pieza IP4234CZ6
Descripción Single USB 2.0 ESD protection to IEC 61000-4-2 level 4
Fabricantes NXP Semiconductors 
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IP4234CZ6
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4
Rev. 01 — 16 April 2009
Product data sheet
1. Product profile
1.1 General description
The IP4234CZ6 is designed to protect Input/Output (I/O) USB 2.0 ports, that are sensitive
to capacitive loads, from being damaged by ElectroStatic Discharge (ESD). The π-filter
structure is implemented with a small series resistor to provide the necessary protection
to signal and supply components from ESD voltages greater than ±8 kV contact discharge
according IEC 61000-4-2, level 4.
The ESD protection is independent of the supply voltage due to the rail-to-rail diode
architecture being connected to a Zener diode.
The IP4234CZ6 is fabricated using monolithic silicon technology and integrates two
ultra-low capacitance π-filter ESD protection diodes plus a Zener diode in a miniature
6-lead SOT457 package.
1.2 Features
I Pb-free and RoHS compliant
I Simple, direct signal routing provides for high speed signal integrity
I ESD protection compliant to IEC 61000-4-2 level 4, ±8 kV contact discharge
I Significant reduction in peak clamping and peak residual current
I Four low input capacitance (2.0 pF typical) rail-to-rail ESD protection diodes
I Low voltage clamping due to an integrated Zener diode
I Small 6-lead SO6 (SOT457) package
I IEC 61000-4-5 15 A Lightning (8/20 µs) compliant
1.3 Applications
I General-purpose downstream ESD protection high frequency analog signals and
high-speed serial data transmission for ports inside:
N Cellular and PCS mobile handsets
N PC/Notebook USB2.0/IEEE1394 ports
N DVI interfaces
N HDMI interfaces
N Cordless telephones
N Wireless data (WAN/LAN) systems
N PDAs

1 page




IP4234CZ6 pdf
NXP Semiconductors
IP4234CZ6
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4
9. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
9.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
9.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
9.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
IP4234CZ6_1
Product data sheet
Rev. 01 — 16 April 2009
© NXP B.V. 2009. All rights reserved.
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