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PDF ESD218-B1 Datasheet ( Hoja de datos )

Número de pieza ESD218-B1
Descripción Protection Device
Fabricantes Infineon 
Logotipo Infineon Logotipo



Total 15 Páginas
		
ESD218-B1 Hoja de datos, Descripción, Manual
Protection Device
TVS (Transient Voltage Suppressor)
ESD218-B1 Series
Bi-directional, 24 V, 3 pF, 0201, 0402, RoHS and Halogen Free compliant
ESD218-B1-02ELS
ESD218-B1-02EL
Data Sheet
Revision 1.1, 2015-01-13
Final
Power Management & Multimarket

1 page

ESD218-B1 pdf
ESD218-B1 Series
Electrical Characteristics
Table 3-1 DC Characteristics at TA = 25 °C, unless otherwise specified 1)
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
Reverse working voltage VRWM
Breakdown voltage
VBR
Reverse leakage current IR
1) Device is electrically symmetrical
-24
24.3
25.5
<1
24
30
50
V
V
nA
Note / Test Condition
IT = 1 mA
VR = 24 V
Table 3-2 AC Characteristics at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Line capacitance
Min.
CL
Typ.
3
3
Max.
3.5
3.5
Series inductance
LS
0.2 –
0.4 –
Unit
pF
nH
Note / Test Condition
VR = 0 V, f = 1 MHz
VR = 0 V, f = 1 GHz
ESD218-B1-02ELS
ESD218-B1-02EL
Table 3-3 ESD and Surge Characteristics at TA = 25 °C, unless otherwise specified 1)
Parameter
Symbol
Values
Unit Note / Test Condition
Min.
Typ.
Max.
Clamping voltage2)
VCL
51
55.5
V ITLP = 16 A, tp = 100 ns
Clamping voltage3)
– 66 70.5
– 37 41.5
ITLP = 30 A, tp = 100 ns
IPP = 1 A, tp = 8/20 µs
Dynamic resistance2)
RDYN
1) Device is electrically symmetrical
40 44.5
IPP = 1.5 A, tp = 8/20 µs
0.9 –
tp = 100 ns
2) Please refer to Application Note AN210[1]. TLP parameter: Z0 = 50 Ω , tp = 100ns, tr = 300ps.
3) Non-repetitive current pulse 8/20µs exponential decay waveform according to IEC61000-4-5
Final Data Sheet
5 Revision 1.1, 2015-01-13

5 Page

ESD218-B1 arduino
5 Package Information
ESD218-B1 Series
Package Information
5.1 TSSLP-2-4
Top view
0.31
+0.01
-0.02
Bottom view
0.32 ±0.05
2
Pin 1
marking
0.05 MAX.
1
0.26±0.035 1)
1) Dimension applies to plated terminals
Figure 5-1 TSSLP-2-4 Package outline
TSSLP-2-3, -4-PO V01
0.32
0.27
Copper Solder mask
Figure 5-2 TSSLP-2-4 Footprint
Stencil apertures
TSSLP-2-3, -4-FP V02
4 0.35
Pin 1
marking
Ex
Figure 5-3 TSSLP-2-4 Packing
Tape type
Ex Ey
Punched Tape 0.43 0.73
Embossed Tape 0.37 0.67
Deliveries can be both tape types (no selection possible).
Specification allows identical processing (pick & place) by users.
TSSLP-2-3, -4-TP V03
Type code
Pin 1 marking
TSSLP-2-3, -4-MK V01
Figure 5-4 TSSLP-2-4 Marking example, Type code see: Table 1-1 “Part Information” on Page 3
Final Data Sheet
11 Revision 1.1, 2015-01-13

11 Page


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