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PDF BTP955E3 Data sheet ( Hoja de datos )

Número de pieza BTP955E3
Descripción PNP Epitaxial Planar High Current (High Performance) Transistor
Fabricantes Cystech Electonics 
Logotipo Cystech Electonics Logotipo



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No Preview Available ! BTP955E3 Hoja de datos, Descripción, Manual

CYStech Electronics Corp.
Spec. No. : C811E3
Issued Date : 2015.06.08
Revised Date :
Page No. : 1/5
PNP Epitaxial Planar High Current (High Performance) Transistor
BTP955E3
BVCEO
IC
-140V
-5A
RCE(SAT) 90mΩ typ.
Features
5 Amps continuous current, up to 10 Amps peak current
Very low saturation voltage
Excellent gain characteristics specified up to 3 Amps
Extremely low equivalent on resistance, RCE(SAT)=90mΩ at 3A
RoHS compliant package
Symbol
BTP955E3
Outline
TO-220
BBase
CCollector
EEmitter
BCE
Ordering Information
Device
BTP955E3-0-UB-G
Package
TO-220
(Pb-free lead plating)
Shipping
50 pcs / tube, 20 tubes/ box , 4 boxes/carton
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, UB : 50 pcs / tube, 20 tubes/box
Product rank, zero for no rank products
Product name
BTP955E3
CYStek Product Specification

1 page




BTP955E3 pdf
CYStech Electronics Corp.
TO-220 Dimension
Marking:
Spec. No. : C811E3
Issued Date : 2015.06.08
Revised Date :
Page No. : 5/5
Device Name
Date Code
955
□□□□
1 23
3-Lead TO-220 Plastic Package
CYStek Package Code: E3
Style: Pin 1.Base 2.Collector 3.Emitter
4.Collector
DIM
Millimeters
Min. Max.
A 4.470 4.670
A1 2.520 2.820
b 0.710 0.910
b1 1.170 1.370
c 0.310 0.530
c1 1.170 1.370
D 10.010 10.310
E 8.500 8.900
Inches
Min. Max.
0.176 0.184
0.099 0.111
0.028 0.036
0.046 0.054
0.012 0.021
0.046 0.054
0.394 0.406
0.335 0.350
*: Typical
DIM
Millimeters
Min. Max.
Inches
Min. Max.
E1 12.060 12.460 0.475 0.491
e 2.540*
0.100*
e1 4.980 5.180 0.196 0.204
F 2.590 2.890 0.102 0.114
h 0.000 0.300 0.000 0.012
L 13.400 13.800 0.528 0.543
L1 3.560 3.960 0.140 0.156
Φ 3.735 3.935 0.147 0.155
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
Lead: Pure tin plated.
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTP955E3
CYStek Product Specification

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