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PDF IGC50T120T6RL Data sheet ( Hoja de datos )

Número de pieza IGC50T120T6RL
Descripción IGBT4 Low Power Chip
Fabricantes Infineon 
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IGC50T120T6RL
IGBT4 Low Power Chip
FEATURES:
1200V Trench + Field Stop technology
low switching losses
positive temperature coefficient
easy paralleling
This chip is used for:
low / medium power modules
Applications:
low / medium power drives
C
G
E
Chip Type
VCE ICn
IGC50T120T6RL 1200V 50A
Die Size
7.25 x 6.84 mm2
Package
sawn on foil
MECHANICAL PARAMETER
Raster size
Emitter pad size (incl. gate pad)
Gate pad size
Area total / active
Thickness
Wafer size
Flat position
Max.possible chips per wafer
Passivation frontside
Pad metal
Backside metal
Die bond
Wire bond
Reject ink dot size
Recommended storage environment
7.25 x 6.84
5.74 x 5.367
0.811 x 1.31
mm 2
49.6 / 34.5
115 µm
150 mm
90 grd
285
Photoimide
3200 nm AlSiCu
Ni Ag –system
suitable for epoxy and soft solder die bonding
Electrically conductive glue or solder
Al, <500µm
0.65mm ; max 1.2mm
Store in original container, in dry nitrogen,
< 6 month at an ambient temperature of 23°C
Edited by IN FINEON Technologies , AIM PMD D CID CLS , L7663C, Edition 1, 31.10.2007

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IGC50T120T6RL pdf
FURTHER ELECTRICAL CHARACTERISTICS
This chip data sheet refers to the
device data sheet
IGC50T120T6RL
tbd
DESCRIPTION
AQL 0,65 for visual inspection according to failure catalogue
Electrostatic Discharge Sensitive Device according to MIL-STD 883
Test-Normen Villach/Prüffeld
Published by
Infineon Technologies AG
81726 Munich, Germany
© Infineon Technologies AG 2007
All Rights Reserved
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Representatives world-wide (see
address list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types
in question please contact your nearest Infineon Technologies Office.
Infineon Technologies components may only be used in life -support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life -support device or system, or to affect the safety or effectiveness of that device or
system. Life support devices or systems are intended to be implanted in the human body, or to support
and / or maintain and sustain and / or protect human life. If they fail, it is reasonable to assume that the
health of the user or other persons may be endangered.
Edited by IN FINEON Technologies , AIM PMD D CID CLS , L7663C, Edition 1, 31.10.2007

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