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Número de pieza ULPMC10
Descripción Microcontroller
Fabricantes ON Semiconductor 
Logotipo ON Semiconductor Logotipo



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ULPMC10
Microcontroller for Struix
System-in-Package (SiP)
Introduction
ULPMC10 is an industry−leading 32−bit microprocessor built
around an ARM® Cortex®−M3 core that is designed for capturing and
processing biometric signals within medical devices. ULPMC10 is
ideally suited to be integrated with custom designed proprietary
application specific integrated circuit (ASICs) within the Struix
System−in−Package (SiP) solution from ON Semiconductor. This
complete energy efficient solution enables manufacturers to develop
miniature, high performance, low power, precision−sensing medical
applications.
ULPMC10 delivers outstanding computational performance and
exceptional system response to events, while meeting the challenges
of low dynamic and static power constraints. The processor is highly
configurable, enabling a wide range of medical implementations from
those requiring low duty−cycle operations to size−sensitive devices
requiring a minimal semiconductor footprint.
ULPMC10 features built−in, advanced power management
including system monitoring for fail−safe operation. This allows for a
wide variety of battery voltages for efficiently powering the device
without the need for external, active components. It encompasses a
combination of charge pump based power conversion and regulation
providing an optimal balance between power and execution speed.
A comprehensive and easy−to−use suite of development tools is
available from IAR Systems including CMSIS based software
interfaces.
www.onsemi.com
1 48
QFN48 6x6
CASE 485AN
MARKING DIAGRAM
XXXXXXXX
AWLYYWWG
XXX = Specific Device Code
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G = Pb−Free Package
Key Features
Powerful and Efficient Processing Architecture
32−bit ARM Cortex−M3 Processor
512 kB On−chip Flash for Program and User Data
Storage
24 kB On−chip SRAM Memory
Flexible DMA, 2 General−purpose Timers, CRC
Calculator
No External Voltage Required for Flash Write
Operation
Ultra Low−Power and Smart Power Management
Less than 200 mA / MHz, up to 5 MHz Clock Speed
Less than 400 mA / MHz, between 5 MHz and 40 MHz
Clock Speed
Flexible Input Voltage Range between 1.3 V; 3.6 V (3
V Nominal Supply Voltage)
Ultra−low−current Sleep Mode with Real−time Clock
Active (< 200 nA)
On−chip Charge Pump for Effective Power Conversion
and Powering of External, Devices such as Wireless
Bluetooth® Low−energy
Low−current Standby Mode with Real−time Clock
Active, Register, and SRAM Retention (< 500 nA)
Integrated Power Supplies Minimize Need for External
Components, Only a Minimum of External Passives is
Required
Clock Management
Built−in RTC with External Crystal
On−chip RC Oscillator for Internal Clock Generation
up to 40 MHz
Integrated PLL (up to 20 MHz Output Signal) – Allow
for RTC Crystal only Operation (no Additional Crystal
Required)
Divider Structure to Efficiently Clock any Portion of
the Device
Analog−to−Digital Conversion
Single 12−bit ADC with 3 Multiplexed Inputs
On−the−fly Data Rate Configurability
Temperature Sensor
Built−in, Junction−based Temperature Sensor Covering
0°C up to 50°C
© Semiconductor Components Industries, LLC, 2015
July, 2015 − Rev. 4
1
Publication Order Number:
ULPMC10/D

1 page




ULPMC10 pdf
ULPMC10
ADC
One 12−bit Analog−to−Digital Converter (ADC) with
three external, configurable inputs is available. The ADC
operates rail−to−rail from 0 V to VDDA (2.0 V) using an
internal precision bandgap voltage reference. Two’s
complement output samples are provided to the ARM
Cortex−M3 processor and synchronized to an ADC
interrupt. The DMA may also be used to transfer samples
directly from the ADC to SRAM.
Temperature Sensor
The device contains a built−in temperature sensor. The
temperature sensor works by generating a differential
voltage that varies linearly with temperature. The voltage is
routed into the ADC resulting in a single−ended output
voltage measurable by the ADC.
The temperature sensor is calibrated during factory
production by ON Semiconductor. The calibration value is
stored in the flash. The device junction temperature may be
determined based on the calibration factor and converted
ADC output value.
ARM Cortex−M3 Processor
The ARM Cortex−M3 processor is a 32−bit RISC
controller specifically designed to meet the needs of
advanced, high−performance, low−power applications. The
ARM Cortex−M3 processor provides outstanding
computational performance and exceptional system
response to interrupts while providing small core footprint,
industry leading code density enabling smaller memories,
reduced pin count and low power consumption.
The ULPMC10 implementation of the ARM Cortex−M3
processor contains all necessary peripherals and bus systems
to provide a complete device optimized for battery powered
sensor interface applications.
Memories
Flash Memory
512 kB flash is available for storage of application code
and data. Flash memory can be written one or more words
at a time. Each page must be erased between writes to a flash
word. The flash memory can be erased as a set all at once or
in individual 2 kB pages. An additional reserved block of
flash memory is used to store factory calibration information
provided by ON Semiconductor. This block cannot be
written by the application. The ARM Cortex−M3 processor
executes application code directly from flash with zero wait
states when the system clock is lower than 20 MHz. Above
20 MHz wait states are inserted. To avoid wait states the
application developer may choose to use the on−chip RAM
cache.
SRAM Memory
24 kB of low−power SRAM is available for storage of
intermediate data as well as application code. A block of
SRAM can be utilized for caching to avoid wait states at high
clock frequencies.
ROM
An on−chip ROM includes boot functionality as well as
firmware routines supporting writing to flash in an
application.
External Interrupt Controller
Two configurable external interrupt sources may be
connected to any two DIO pins on the device. This is in
addition to the four possible interrupts for the wakeup
controller. Each interrupt may be individually configured
for positive edge triggering, negative edge triggering, high
level triggering, or low level triggering.
DMA
A flexible DMA unit supports low overhead data
exchange between system blocks. Memory−to−Peripheral,
Peripheral−to−Memory, and Memory−to−Memory modes
are available. Four simultaneous DMA channels can be
established with configurable sources and sinks.
The DMA can be used with the UART, SPI, I2C, and PCM
interfaces, as well as the ADC.
The DMA operates in the background allowing the ARM
Cortex−M3 processor to execute other applications or to
reduce its operating frequency to conserve power.
General−Purpose Timers
The device contains two general−purpose timers. Each
timer features a 12−bit countdown mode, an external
interrupt to the ARM Cortex−M3 processor, a dedicated
prescaler, and the ability to poll the counter value. These four
general−purpose timers are in addition to the 24−bit
SYSTICK timer included as part of the ARM Cortex−M3
processor.
CRC Engine
A 16−bit hardware CRC engine is available. The CRC
engine may be used to ensure data integrity of application
code and data. The CRC engine’s input port and output port
are directly accessible from the ARM Cortex−M3 processor.
The starting vector may be set to any value. Subsequently,
data words of multiple bit lengths can be added to the CRC.
The 16−bit CRC−CCITT polynomial is used.
Watchdog Timer
The device contains a digital watchdog timer. The
watchdog timer is intended to prevent an indefinite system
hang when an application error occurs. The application must
periodically refresh the watchdog counter during operation.
If a watchdog timeout occurs an initial alert interrupt is
generated. If a subsequent watchdog timeout occurs, a
system reset is generated. The initial alert may be used to
gracefully shut down the system.
www.onsemi.com
5

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ULPMC10 arduino
ULPMC10
ULPMC10 QFN48 Sample Package Overview
Table 2. PIN OUT
Pin#
2
3
10
11
12
16
Pad Name
DIO1
DIO2
DIO3
DIO4
DIO5
AUX0_DIO27
17 AUX1_DIO28
18 AUX2
22 VDDA
23 VSSA
24 VDDD
25 VDD
27 VDDC
29 RESET
32 DIO6
33 DIO7
34 VDDO
35 EN_TEST
36 VSSD
36 VSSO
37 SWDIO
38 SWCLK
39 DIO8
40 DIO9
41 DIO10
42 DIO11
44 DIO12
45 DIO13
46 DIO14
47 DIO15
48 DIO16
1 DIO0
30 EXT_CLK
31 WAKEUP
43 DIO17
(CLK_OUT)
4 DIO18
5 DIO19
6 DIO20
Description
Digital Input Output
Digital Input Output
Digital Input Output
Digital Input Output
Digital Input Output
Digital Input Output configuration
LSAD channel 0 configuration
Digital Input Output configuration
LSAD channel 1 configuration
LSAD channel 2 input
Analog supply
Analog ground
Digital core supply
Power supply 1
Power supply 2 / CP output
External reset signal
Digital Input Output
Digital Input Output
IO supply
Test enable
Digital ground
IO ground
Digital JTAG debug (Data IO)
Digital JTAG debug (Clk)
Digital Input Output
Digital Input Output
Digital Input Output
Digital Input Output
Digital Input Output
Digital Input Output
Digital Input Output
Digital Input Output
Digital Input Output
Digital Input Output
External clock for MMCU
Wakeup Interrupt
Digital Input Output, ADC clock
output
Digital Input Output
Digital Input Output
Digital Input Output
Domain
VDDO
VDDO
VDDO
VDDO
VDDO
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDDO
VDDO
VDDO
VDDO
VDDO
VDDO
VDDO
VDDO
VDDO
VDDO
VDDO
VDDO
VDDO
VDDO
VDDO
VDDO
VDDO
VDDO
VDD
VDD
VDDO
VDDO
VDDO
VDDO
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