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PDF NCX8200 Data sheet ( Hoja de datos )
| Número de pieza | NCX8200 | |
| Descripción | Audio jack configuration switch matrix | |
| Fabricantes | NXP Semiconductors | |
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NCX8200
Audio jack configuration switch matrix
Rev. 1 — 15 May 2015
Product data sheet
1. General description
The NCX8200 is an advanced audio jack configuration switch matrix device that supports
3- and 4-pole connectors. It allows reconfiguration of the GND, microphone-bias contact
to comply with the American Headset Jack (AHJ) and the Open Mobile Terminal Platform
(OMTP) pinout. Furthermore, a GND sense path supports quasi-differential amplifier
architectures. The device contains Human Body Model compliant ESD protection diodes
rated 8 kV at all pins. The device can be operated from a supply in the range of 1.6 V to
3.6 V. It supports a broad variety of after-market headphones.
2. Features and benefits
AHJ and OMTP headset jack pinout support
Low supply current
Sense path to GND for quasi differential amplifier configuration
Low THD and noise microphone pass through channel
Ultra low RDSon of ground and sense switches
High power supply ripple rejection
ESD protection: HBM JEDEC JDS-001 Class 3B exceeds 8 kV
Operating ambient temperature: 40C to +85C
1.22 mm 1.22 mm 0.5 mm WLCSP9 package
3. Applications
Headphones with integrated microphone and remote control buttons
4. Ordering information
Table 1. Ordering information
Type number
Package
Name
Description
NCX8200UK
WLCSP9 wafer chip-scale package; 9 bumps; 1.22 1.22 0.5 mm
5. Marking
Version
NCX8200UK
Table 2. Marking codes
Type number
NCX8200UK
Marking code
qx82
1 page  
NXP Semiconductors
NCX8200
Audio jack configuration switch matrix
10. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to
GND (ground = 0 V).
Symbol Parameter
Conditions
Min Max Unit
VDD supply voltage
0.5 +3.6
V
VI/O
input/output voltage
MIC, CON1, CON2, Sense,
0.5
VDD
V
SNS1, SNS2
VI input voltage
ISW(GRD) switch current
SEL
continuous current from
CON1 or CON2 to GND
0.5
-
VDD + 0.1 V
100 mA
ISW(MIB) switch current
continuous current from - 50 mA
MIC to CON1 or CON2
ISW(SNS) switch current
continuous current from
Sense to SNS1 or SNS2
-
50 mA
Tj(max)
maximum junction
temperature
40
+125
C
Tstg storage temperature
Ptot total power dissipation
65
+150
C
- 530 mW
11. Recommended operating conditions
Table 5.
Symbol
VDD
VI/O
VI
Tamb
Recommended operating conditions
Parameter
Conditions
supply voltage
input/output voltage
MIC, CON1, CON2,
Sense, SNS1, SNS2
input voltage
SEL
ambient temperature
Min Max Unit
1.6 3.6 V
0.3 VDD V
0.3 VDD V
40 +85 C
12. Thermal characteristics
Table 6.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from junction to
ambient
Conditions
Typ
[1][2] 75.5
Unit
K/W
[1] The overall Rth(j-a) can vary depending on the board layout. To minimize the effective Rth(j-a), all pins must
have a solid connection to larger Cu layer areas e.g. to the power and ground layer. In multi-layer PCB
applications, the second layer should be used to create a large heat spreader area right below the device. If
this layer is either ground or power, it should be connected with several vias to the top layer connecting to
the device ground or supply. Try not to use any solder-stop varnish under the chip.
[2] Rely on the measurement data given for rough estimation of the Rth(j-a) in your application. The actual
Rth(j-a) value may vary in applications using different layer stacks and layouts.
NCX8200
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 May 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
5 of 14
5 Page 
NXP Semiconductors
NCX8200
Audio jack configuration switch matrix
16. Abbreviations
Table 9. Abbreviations
Acronym
Description
THD
Total Harmonic Distortion
CDM
Charged Device Model
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MOSFET
Metal-Oxide Semiconductor Field Effect Transistor
17. Revision history
Table 10. Revision history
Document ID
Release date
NCX8200 v.1
20150515
Data sheet status
Product data sheet
Change notice
-
Supersedes
-
NCX8200
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 May 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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