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PDF C6011 Data sheet ( Hoja de datos )
| Número de pieza | C6011 | |
| Descripción | NPN Transistor - 2SC6011 | |
| Fabricantes | Allegro | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de C6011 (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
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2SC6011
Audio Amplification Transistor
Features and Benefits
▪ Small package (TO-3P)
▪ High power handling capacity, 160 W
▪ Improved sound output by reduced on-chip impedance
▪ For professional audio (PA) applications, VCEO = 200 V
versions available
▪ Complementary to 2SA2151
▪ Recommended output driver: 2SC4832
Package: 3 Lead TO-3P
Description
By adapting the Sanken unique wafer-thinner technique, these
NPN power transistors achieve power-up by decreasing thermal
resistance, and provide higher voltage avalanche breakdown
rating.The high power-handling capacity of the TO-3Ppackage
allows a smaller footprint on the circuit board design. This
series of transistors is very well suited to not only multichannel
applications for AV (audio-visual) amplifiers and receivers,
but also parallel connection applications for PA (professional
audio system) amplifiers.
Applications include the following:
▪ Single transistors for audio amplifiers
▪ Home audio amplifiers
▪ Professional audio amplifiers
▪ Automobile audio amplifiers
▪ Audio market
▪ Single transistors for general purpose
www.DataSheet4U.com
38102
1 page  
2SC6011
Audio Amplification Transistor
PACKAGE OUTLINE DRAWING, TO-3P
15.6 ±0.3
14.0 ±0.3
13.6 ±0.2
9.6 ±0.3
5.0 MAX
2.1 MAX
Branding
XXXXXXXX
XXXXXXXX
3
+0.2
–0.1
2
+0.2
–0.1
(2×)
1.0
+0.2
–0.1
(3×)
2×P5.45 ±0.1
Terminal dimension at lead tips
1.7
+0.2
–0.3
0.6
+0.2
–0.1
15.8 ±0.2
12
Terminal core material: Cu
Terminal treatment: Ni plating and solder dip
Heat sink core material: Cu
Heat sink treatment: Ni plating
Leadform number: 100
3
Dimensions in millimeters
Pin Assignments:
1. Base
2. Collector
3. Emitter
Branding codes (exact appearance at manufacturer discretion):
1st line, type: C6011
2nd line, lot: YM H
Where: Y is the last digit of the year of manufacture
M is the month (1 to 9, O, N, D)
H is the hFE rating (O, P, or Y; for values see
footnote, Electrical Characteristics table)
Leadframe plating Pb-free. Device composition
includes high-temperature solder (Pb >85%),
which is exempted from the RoHS directive.
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
5
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet C6011.PDF ] | |
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