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PDF NCP81251 Data sheet ( Hoja de datos )

Número de pieza NCP81251
Descripción Single-Phase Voltage Regulator
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NCP81251
Single-Phase Voltage
Regulator with SVID
Interface for Computing
Applications
High Switching Frequency, High
Efficiency, Integrated Power MOSFETs
The NCP81251, a single−phase synchronous buck regulator,
integrates power MOSFETs to provide a high−efficiency and
compact−footprint power management solution for new generation
computing CPUs. The device is able to deliver up to 14 A TDC output
current on an adjustable output with SVID interface. Operating in high
switching frequency up to 1.2 MHz allows employing small size
inductors and capacitors while maintaining high efficiency due to
integrated solution with high performance power MOSFETs.
Current−mode RPM control with feedforward from both input power
supply and output voltage ensures stable operation over wide
operation condition. The NCP81251 is in a QFN48 6 x 6 mm package.
Features
Meets Intel® Server Specifications
5 V to 20 V Input Voltage Range
1.0 V/1.1 V Fixed Boot Voltage
Adjustable Output Voltage with SVID Interface
Integrated Gate Driver and Power MOSFETs
Up to 14 A TDC Output Current
500 kHz ~ 1.2 MHz Switching Frequency
Current−Mode RPM Control
Programmable SVID Address and ICCMax
Adaptive Voltage Positioning (AVP)
Programmable DVID Feed−Forward to Support Fast DVID
Feedforward Operation for Input Supply Voltage and Output Voltage
Output Over−Voltage and Under−Voltage Protections
External Current Limitation Programming with Inductor Current
Sense
QFN48, 6 x 6 mm, 0.4 mm Pitch Package
This is a Pb−Free Device
Typical Applications
Server Applications
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MARKING
DIAGRAM
1 48
QFN48
CASE 485CJ
1
NCP81251
AWLYYWWG
NCP81251 = Specific Device Code
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G = Pb−Free Package
ORDERING INFORMATION
Device
Package Shipping
NCP81251MNTXG
QFN48 2500 / Tape &
(Pb−Free)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2015
September, 2015 − Rev. 1
1
Publication Order Number:
NCP81251/D

1 page




NCP81251 pdf
NCP81251
Table 2. MAXIMUM RATINGS
Value
Power Supply Voltage to PGND
Switch Node to PGND
Analog Supply Voltage to GND
BST to PGND
Rating
Symbol
VVIN
VSW
VCC, VCCP
BST_PGND
Min Max Unit
30 V
30 V
−0.3 6.5 V
−0.3 33 V
38 (<50 ns)
BST to SW
BST_SW
−0.3
6.5 V
GH to SW
GH
−0.3
BST+0.3
V
−2 (<200 ns)
GL to GND
GL
−0.3
VCCP+0.3
V
−2 (<200 ns)
VSN to GND
VSN −0.3 0.3 V
IOUT
IOUT −0.3 2.5 V
PGND to GND
PGND
−0.3
0.3 V
Other Pins
−0.3
VCC+0.3
V
Latch up Current: (Note 1)
All pins, except digital pins
Digital pins
ILU mA
−100
100
−10 10
Operating Junction Temperature Range
TJ −40 125 °C
Operating Ambient Temperature Range
TA −40 125 °C
Storage Temperature Range
TSTG −40 150 °C
Thermal Resistance Junction to Board (Note 2)
RθJB
8.2 °C/W
Thermal Resistance Junction to Ambient (Note 2)
RθJA
21.8 °C/W
Power Dissipation at TA = 25°C (Note 3)
PD 4.59 W
Moisture Sensitivity Level (Note 4)
MSL
3−
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Latch up Current per JEDEC standard: JESD78 class II.
2. The thermal resistance values are dependent of the internal losses split between devices and the PCB heat dissipation. This data is based
on a typical operation condition with a 4−layer FR−4 PCB board, which has two, 1−ounce copper internal power and ground planes and
2−ounce copper traces on top and bottom layers with approximately 80% copper coverage. No airflow and no heat sink applied (reference
EIA/JEDEC 51.7). It also does not account for other heat sources that may be present on the PCB next to the device in question (such as
inductors, resistors etc.)
3. The maximum power dissipation (PD) is dependent on input voltage, output voltage, output current, external components selected, and PCB
layout. The reference data is obtained based on TJMAX = 125°C and RθJA = 21.8°C/W.
4. Moisture Sensitivity Level (MSL): 3 per IPC/JEDEC standard: J−STD−020D.1.
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NCP81251 arduino
NCP81251
DETAILED DESCRIPTION
General
The NCP81251, a single−phase synchronous buck
regulator, integrates power MOSFETs to provide a
high−efficiency and compact−footprint power management
solution for new generation computing CPUs. The device is
able to deliver up to 14 A TDC output current on an
adjustable output with SVID interface. Operating in high
switching frequency up to 1.2 MHz allows employing small
size inductors and capacitors while maintaining high
efficiency due to integrated solution with high performance
power MOSFETs. Current−mode RPM control with
feedforward from both input power supply and output
voltage ensures stable operation over wide operation
condition.
Current−Mode RPM Operation
The NCP81251 operates with the current−mode
Ramp−Pulse−Modulation (RPM) scheme in PS0/1/2/3
operation modes. In forced CCM mode, the inductor current
is always continuous and the device operates in quasi−fixed
switching frequency, which has a typical value programmed
by users through a resistor at pin FREQ. In auto CCM/DCM
mode, the inductor current is continuous and the device
operates in quasi−fixed switching frequency in medium and
heavy load range, while the inductor current becomes
discontinuous and the device automatically operates in PFM
mode with an adaptive fixed on time and variable switching
frequency in light load range.
Serial VID interface (SVID)
The NCP81251 supports Intel serial VID interface. It
communicates with the microprocessor through three wires
(SCLK, SDIO, ALERT#). For NCP81251, VID code
change rate is controlled by the SVID interface with three
options. Information regarding SVID interface can be
obtained from Intel.
Boot Voltage and SVID Address
Table 5 shows two boot voltage options of 1.0 V and 1.1 V
programmed by an external 1% resistor Rvboot from Vboot
pin to GND, which programs SVID address as well. Both
Vboot voltage and SVID address are set on power up and
cannot be changed after the initial power up sequence is
complete.
Table 5. BOOT VOLTAGE AND SVID ADDRESS CONFIGURATION
Rvboot
(W)
Vboot Pin Voltage (mV)
Min Typ Max
0 0 0 102
14.0k
102
140
180
22.1k
180
219
258
30.1k
258
301
344
39.2k
344
391
438
48.7k
438
484
531
57.6k
531
578
625
68.1k
625
676
727
78.7k
727
781
836
88.7k
836
894
953
100k
953
1007
1062
113k
1062
1125
1188
124k
1188
1250
1312
137k
1312
1378
1445
150k
1445
1511
1578
165k
1578
1648
1719
178k
1719
1789
1859
196k
1859
1950
Address
0x0
0x1
0x2
0x3
0x4
0x5
0x6
0x7
0x8
0x0
0x1
0x2
0x3
0x4
0x5
0x6
0x7
0x8
Vboot
(V)
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.1
1.1
1.1
1.1
1.1
1.1
1.1
1.1
1.1
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