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PDF G2998 Data sheet ( Hoja de datos )
| Número de pieza | G2998 | |
| Descripción | DDR Termination Regulator | |
| Fabricantes | Global Mixed-mode Technology | |
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Global Mixed-mode Technology
G2998/G2999
DDR Termination Regulator
Features
Support and DDR I (1.25VTT), DDR II (0.9 VTT) ,
DDR III (0.75 VTT) , and DDR IIIL (0.675VTT)
Requirements
Input Voltage Range: 3V to 5.5V
VTT_IN Voltage Range: 1.2V to 3.6V
Requires Only 20µF Ceramic Output Capacitance
VTT Pulled Low by 2kΩ Resistor in Stand-By
Mode (G2998 version)
VTT Tri-State in Stand-By Mode
(G2999 version)
Integrated Divider Tracks 1/2 VDDQ for Both
VTT and VREF
Remote Sensing (VTTS)
±20mV Accuracy for VTT
±30mV Accuracy for VREF
Built-In Soft-Start
Over Current Protection
Thermal Shutdown Protection
MSOP-8 and SOP-8(Thermal Pad) Package
low-external component count systems. The G2998/
G2999 maintains a high speed operational amplifier that
provides fast load transient response and only requires
20μF (2 × 10μF) of ceramic output capacitance. The
G2998/G2999 supports remote sensing functions and
all features required to power the DDR I / DDR II / DDR
III / DDR IIIL VTT bus termination according to the
JEDEC specification. In addition, the G2998/ G2999
also has an Enable (EN) pin that provides Suspend to
RAM (STR) functionality. When EN is pulled low, VREF
will remain active, but VTT output will be turned off and
discharged to the ground through internal MOSFETs in
G2998 version and VTT output will be in tri-state in
G2999 version. A power saving advantage can be ob-
tained in this mode through lowering the quiescent cur-
rent to150μA @ VCC=3.3V.
The G2998/G2999 is available in the MSOP-8 and
SOP-8 package with the Thermal pad.
Ordering Information
Applications
DDR I/II/III/IIIL Memory Termination
SSTL−2, SSTL−18
HSTL Termination
General Description
The G2998/G2999 is a 3A sink/source tracking termi-
nation regulator. It is specifically designed for low-cost/
Pin Configuration
ORDER
NUMBER
MARKING
TEMP.
RANGE
G2998P81U
G2998
-40°C~85°C
G2998F11U
G2998
-40°C~85°C
G2999F11U
G2999
-40°C~85°C
Note: P8: MSOP-8
F1: SOP-8 (FD)
1: Bonding Code
U: Tape & Reel
PACKAGE
(Green)
MSOP-8
SOP-8 (FD)
SOP-8 (FD)
GND 1
G2998
8 VTT
G2998/G2999
GND 1
8 VTT
EN 2
VTTS 3
7 VTT_IN EN 2
6 VCC
VTTS 3
T hermal
Pad
7 VTT_IN
6 VCC
VREF 4
5 VDDQ VREF 4
5 VDDQ
MSOP- 8
Top View
SOP- 8 (FD)
Note: Recommend c onnec ting the Thermal Pad
to the GND for excellent power dis sipation.
1 .8V
V CC=3.3V
EN
DDR II
VTT_IN VREF
VDDQ
VCC
VTTS
E N VTT
G ND
C2
0. 1µ F
C1
2 x 1 0µF
Typical Application Circuit
2 .5 V
VC C= 3. 3V
EN
DDR I
VTT_IN V REF
VDDQ
VCC
VTTS
EN VTT
GND
C2
0. 1µ F
C1
2 x 10µF
1.5V
V CC=3.3V
EN
DDR III*
VTT_IN VREF
VDDQ
VCC
VTTS
E N VTT
G ND
* Recommen ded VCC =3.3V
C2
0. 1µ F
C1
2 x 1 0µF
Ver: 1.5
Nov 22, 2011
TEL: 886-3-5788833
http://www.gmt.com.tw
1
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| Páginas | Total 1 Páginas | |
| PDF Descargar | [ Datasheet G2998.PDF ] | |
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