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Número de pieza | MC10166 | |
Descripción | 5-Bit Magnitude Comparator | |
Fabricantes | ON Semiconductor | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de MC10166 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
No Preview Available ! MC10166
5−Bit Magnitude
Comparator
The MC10166 is a high speed expandable 5−bit comparator for
comparing the magnitude of two binary words. Two outputs are
provided: A < B and A > B. A = B can be obtained by NORing the two
outputs with an additional gate. A high level on the enable function
forces both outputs low. Multiple MC10166s may be used for larger
word comparisons.
• PD = 440 mW typ/pkg (No Load)
• tpd =Data to Output 6.0 ns typ
• E to output 2.5 ns typ
• tr, tf = 2.0 ns typ (20%−80%)
LOGIC DIAGRAM
A4 9
B4 10
A3 12
B3 11
A2 13
B2 14
A1 6
B1 7
2A>B
3A<B
A0 5
B0 4
E 15
E
H
L
L
L
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
TRUTH TABLE
Inputs
AB
XX
Word A = Word B
Word A > Word B
Word A < Word B
Outputs
A<B
A>B
LL
LL
LH
HL
http://onsemi.com
CDIP−16
L SUFFIX
CASE 620
PDIP−16
P SUFFIX
CASE 648
MARKING
DIAGRAMS
16
MC10166L
AWLYYWW
1
16
MC10166P
AWLYYWW
11
PLCC−20
FN SUFFIX
CASE 775
10166
AWLYYWW
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
DIP PIN ASSIGNMENT
VCC1
A>B
1
2
A<B 3
B0 4
A0 5
A1 6
B1 7
VEE 8
16 VCC2
15 E
14 B2
13 A2
12 A3
11 B3
10 B4
9 A4
Pin assignment is for Dual−in−Line Package.
For PLCC pin assignment, see the Pin Conversion Tables
on page 18 of the ON Semiconductor MECL Data Book
(DL122/D).
ORDERING INFORMATION
Device
Package
Shipping
MC10166L
CDIP−16
25 Units / Rail
MC10166P
PDIP−16
25 Units / Rail
MC10166FN
PLCC−20
46 Units / Rail
© Semiconductor Components Industries, LLC, 2006
June, 2006 − Rev. 7
1
Publication Order Number:
MC10166/D
1 page MC10166
PACKAGE DIMENSIONS
PLCC−20
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775−02
ISSUE C
B 0.007 (0.180) M T L−M S N S
−N− Y BRK
D
U 0.007 (0.180) M T L−M S N S
−L−
−M−
Z
W
20 1
V
D X G1 0.010 (0.250) S T L−M S N S
VIEW D−D
A 0.007 (0.180) M T L−M S N S
Z
R 0.007 (0.180) M T L−M S N S
K1
H 0.007 (0.180) M T L−M S N S
CE
G
G1
0.010 (0.250) S T L−M S
0.004 (0.100)
J −T− SEATING
PLANE
VIEW S
NS
K
F
VIEW S
0.007 (0.180) M T L−M S N S
NOTES:
1. DATUMS −L−, −M−, AND −N− DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM −T−, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC
1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 −−− 0.51 −−−
K 0.025 −−− 0.64 −−−
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y −−− 0.020 −−− 0.50
Z 2_ 10_ 2 _ 10 _
G1 0.310 0.330 7.88 8.38
K1 0.040 −−− 1.02 −−−
http://onsemi.com
5
5 Page |
Páginas | Total 6 Páginas | |
PDF Descargar | [ Datasheet MC10166.PDF ] |
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