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PDF KLMAG2WEPD-B031 Data sheet ( Hoja de datos )

Número de pieza KLMAG2WEPD-B031
Descripción eMMC
Fabricantes Samsung 
Logotipo Samsung Logotipo

KLMAG2WEPD-B031 image


1. 16 GB, eMMC - Samsung






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No Preview Available ! KLMAG2WEPD-B031 Hoja de datos, Descripción, Manual

SAMSUNG CONFIDENTIAL
Rev. 1.0 Aug. 2014
KLMxGxxEPD-B031
Samsung e·MMC Product family
e.MMC 5.0 Specification compatibility
SAMSUNG
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property
right is granted by one party to the other party under this document, by implication, estoppel or other-
wise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment, or
similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions
may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
All brand names, trademarks and registered trademarks belong to their respective owners.
2014 Samsung Electronics Co., Ltd. All rights reserved.
-1-

1 page




KLMAG2WEPD-B031 pdf
KLMxGxxEPD-B031
datasheet
SAMSUNG CONFIDENTIAL
Rev. 1.0
e·MMC
3.0 PACKAGE CONFIGURATIONS
3.1 153 Ball Pin Configuration
[Table 2] 153 Ball Information
Pin NO
A3
Name
DAT0
A4 DAT1
Ball-side down view
A5 DAT2
NC
B2 DAT3
DNU DNU DNU DNU
DNU
DNU
DNU
B3 DAT4
B4 DAT5
B5 DAT6
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
B6 DAT7
DNU DNU
DNU
K5 RSTN
C6 VDD
1 2 3 4 5 6 7 8 9 10 11 12 13 14
A DAT0 DAT1 DAT2 Vss RFU
M4 VDD
B DAT3 DAT4 DAT5 DAT6 DAT7
N4 VDD
C VDDI Vss VDD
P3 VDD
P5 VDD
E6 VDDF
F5 VDDF
D
E RFU VDDF Vss RFU RFU RFU
F VDDF
RFU
J10 VDDF
G RFU Vss
RFU
K9 VDDF
C2 VDDI
SAMSUNGM5 CMD
H SDtraotbae
Vss
J Vss VDDF
K RSTN RFU RFU Vss VDDF RFU
H5 Data Strobe
L
M6 CLK
J5 VSS
A6 VSS
C4 VSS
gl@teMchtronVDDicCMDsC.LcK om.cn
N Vss VDD Vss
P VDD Vss VDD Vss RFU
RFU
E7 VSS
G5 VSS
H10 VSS
K8 VSS
N2 VSS
N5 VSS
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU DNU
DNU
DNU DNU
DNU
DNU
DNU DNU
DNU
DNU
P4 VSS
P6 VSS
Figure 1. 153-FBGA
CLK : Clock input
Data Strobe : Newly assigned pin for HS400 mode. Data Strobe is generated from e.MMC to host.
In HS400 mode, read data and CRC response are synchronized with Data Strobe.
CMD : A bidirectional signal used for device initialization and command transfers.
Command operates in two modes, open-drain for initialization and push-pull for fast command transfer.
DAT0-7 : Bidirectional data channels. It operates in push-pull mode.
RST_n : H/W reset signal pin
VDDF(VCC) : Supply voltage for flash memory
VDD(VCCQ) : Supply voltage for memory controller
VDDi : Internal power node to stabilize regulator output to controller core logics
VSS : Ground connections
RFU : Reserved for future use , do not use for any usage
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
-5-

5 Page





KLMAG2WEPD-B031 arduino
KLMxGxxEPD-B031
datasheet
SAMSUNG CONFIDENTIAL
Rev. 1.0
e·MMC
5.1.2 Boot operation
Device supports not only boot mode but also alternative boot mode. Device supports high speed timing and dual data rate during boot.
CLK
CMD
DAT[0]
S 010
(1)
E
(2)
CMD1 RESP CMD2 RESP
S
512bytes
+CRC
E
Boot terminated
MIn 8 cloks + 48 clocks = 56 clocks required from
CMD signal high to next MMC command.
*(1) Boot ACK Time (2) Boot Data Time
Figure 4. embedded MultiMediaCard state diagram (boot mode)
CLK
CMD
CMD01
CMD0CRMeDse1t
CMD1
RESP
CMD2
DAT[0]
Min74
Clocks
required
after
power is
stable to
sctoamrtmbaonodt
S 010 E
(1)
(2)
S
512bytes
+CRC
E
Boot terminated
(3)
*(1) Boot ACK Time (2) Boot Data Time (3) CMD1 Time
*CMD0 with argument 0xFFFFFFFA
SAMSUNGFigure 5. embedded MultiMediaCard state diagram (alternative boot mode)
[Table 9] Boot ack, boot data and initialization Time
Timing Factor
(1) Boot ACK Time
(2) Boot Data Time
(3) Initialization Time1)
Value
< 50 ms
< 100 ms
< 3 secs
NOTE:
1) This initialization time includes partition setting, Please refer to INI_TIMEOUT_AP in 6.4 Extended CSD Register.
Normal initialization time (without partition setting) is completed within 1sec
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
- 11 -

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