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PDF M24128-BR Data sheet ( Hoja de datos )

Número de pieza M24128-BR
Descripción 128-Kbit serial I2C bus EEPROM
Fabricantes STMicroelectronics 
Logotipo STMicroelectronics Logotipo



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TSSOP8 (DW)
169 mil width
SO8 (MN)
150 mil width
UFDFPN8
(MC)
WLCSP (CS)
UFDFPN5
(MH)
Unsawn wafer
M24128-BW M24128-BR
M24128-BF M24128-DF
128-Kbit serial I²C bus EEPROM
Datasheet - production data
Features
Compatible with all I2C bus modes:
– 1 MHz
– 400 kHz
– 100 kHz
Memory array:
– 128 Kbit (16 Kbyte) of EEPROM
– Page size: 64 byte
– Additional Write lockable page
(M24128-D order codes)
Single supply voltage and high speed:
– 1 MHz clock from 1.7 V to 5.5 V
Write:
– Byte Write within 5 ms
– Page Write within 5 ms
Operating temperature range:
– from -40 °C up to +85 °C
Random and sequential Read modes
Write protect of the whole memory array
Enhanced ESD/Latch-Up protection
More than 4 million Write cycles
More than 200-years data retention
Packages
SO8 ECOPACK2®
TSSOP8 ECOPACK2®
UFDFPN8 ECOPACK2®
WLCSP ECOPACK2®
UFDFPN5 ECOPACK2®
Unsawn wafer (each die is tested)
June 2016
This is information on a product in full production.
DocID16892 Rev 28
1/46
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1 page




M24128-BR pdf
M24128-BW M24128-BR M24128-BF M24128-DF
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8-pin package connections, top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
UFDFPN5 package connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
WLCSP connections for the M24128-DFCS6TP/K. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Chip enable inputs connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
I2C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 15
Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 16
Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Maximum Rbus value versus bus parasitic capacitance (Cbus) for
an I2C bus at maximum frequency fC = 400 kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
aMnaIx2imC ubmusRabtums vaaxliumeuvmerfsreuqsubeunscypafCra=si1ticMcHazpa. c. i.ta.n.c.e.
Cbus)
.....
for
...
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31
AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
UFDFPN5 – 1.7x1.4 mm, 0.55 mm thickness, ultra thin fine pitch
dual flat package, no lead - package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
UFDFPN8 – 2x3 mm, 0.55 thickness, ultra thin fine pitch
dual flat package, no lead - package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
TSSOP8 – 3x4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline,
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width, package outline . 37
SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width,
package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
M24128-DFCS6TP/K, WLCSP 8-bump wafer-level chip scale package outline . . . . . . . . 39
WLCSP 8-bump wafer-length chip-scale package recommended
land pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
DocID16892 Rev 28
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M24128-BR arduino
M24128-BW M24128-BR M24128-BF M24128-DF
4 Device operation
Device operation
The device supports the I2C protocol. This is summarized in Figure 7. Any device that sends
data on to the bus is defined to be a transmitter, and any device that reads the data to be a
receiver. The device that controls the data transfer is known as the bus master, and the
other as the slave device. A data transfer can only be initiated by the bus master, which will
also provide the serial clock for synchronization. The device is always a slave in all
communications.
Figure 7. I2C bus protocol
3#,
3$!
34!24
#ONDITION
3$!
)NPUT
3$!
#HANGE
34/0
#ONDITION
3#,
3$!

-3"
34!24
#ONDITION

3#,
3$!

-3"


!#+

!#+
34/0
#ONDITION
!)"
DocID16892 Rev 28
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