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PDF EPC1009 Data sheet ( Hoja de datos )

Número de pieza EPC1009
Descripción Enhancement Mode Power Transistor
Fabricantes EPC 
Logotipo EPC Logotipo



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DATASHEET
EPC1009 – Enhancement Mode Power Transistor
VDSS , 60 V
RDS(ON) , 30 mW
ID , 6 A
EPC1009
EFFICIENT POWER CONVERSION
Gallium Nitride is grown on Silicon Wafers and processed using standard CMOS equipment leverag-
ing the infrastructure that has been developed over the last 55 years. GaN’s exceptionally high elec-
tron mobility and low temperature coefficient allows very low RDS(ON), while its lateral device structure
and majority carrier diode provide exceptionally low QG and zero QRR. The end result is a device that
can handle tasks where very high switching frequency, and low on-time are beneficial as well as
those where on-state losses dominate.
Maximum Ratings
VDS Drain-to-Source Voltage
60
ID
Continuous (TA = 25˚C, θJA = 20)
Pulsed (25˚C, Tpulse = 300 µs)
6
25
VGS
Gate-to-Source Voltage
Gate-to-Source Voltage
6
-5
TJ Operating Temperature
TSTG Storage Temperature
-40 to 125
-40 to 150
V
A
V
˚C
PARAMETER
Static Characteristics (TJ= 25˚C unless otherwise stated)
BVDSS
Drain-to-Source Voltage
IDSS Drain Source Leakage
IGSS
Gate-Source Forward Leakage
Gate-Source Reverse Leakage
VGS(TH)
Gate Threshold Voltage
RDS(ON)
Drain-Source On Resistance
TEST CONDITIONS
VGS = 0 V, ID = 75 µA
VDS = 48 V, VGS = 0 V
VGS = 5 V
VGS = -5 V
VDS = VGS, ID = 1.2 mA
VGS = 5 V, ID = 6 A
Dynamic Characteristics (TJ= 25˚C unless otherwise stated)
CISS Input Capacitance
COSS Output Capacitance
CRSS Reverse Transfer Capacitance
QG Total Gate Charge (VGS = 5 V)
QGD Gate to Drain Charge
QGS Gate to Source Charge
QOSS Output Charge
QRR Source-Drain Recovery Charge
VDS = 30 V, VGS = 0 V
VDS = 30 V, ID = 6 A
Source-Drain Characteristics (TJ= 25˚C unless otherwise stated)
VSD
Source-Drain Forward Voltage
IS = 0.5 A, VGS = 0 V, T = 25˚C
IS = 0.5 A, VGS = 0 V, T = 125˚C
MIN
60
0.7
EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2011 |
EPC Power Transistors are supplied only in
passivated die form with solder bumps
Applications
• High Speed DC-DC conversion
• Class D Audio
• Hard Switched and High Frequency Circuits
Benefits
• Ultra High Efficiency
• Ultra Low RDS(on)
• Ultra low QG
• Ultra small footprint
TYP MAX UNIT
V
20 60 µA
0.25
0.1
2
0.5
mA
1.4 2.5 V
24 30 mΩ
196
120 pF
11
2.4
0.63
0.75 nC
5.8
0
1.8
1.75
V
| PAGE 1

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