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PDF KLM8G4DEHE-B101 Data sheet ( Hoja de datos )
| Número de pieza | KLM8G4DEHE-B101 | |
| Descripción | eMMC moviNAND | |
| Fabricantes | Samsung | |
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Rev. 0.0, Jan. 2010
KLMxGxxEHx
Draft
Samsung eMMC moviNAND Product family
eMMC Specification compatibility
datasheet
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property
right is granted by one party to the other party under this document, by implication, estoppel or other-
wise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment, or
similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions
may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
All brand names, trademarks and registered trademarks belong to their respective owners.
ⓒ 2010 Samsung Electronics Co., Ltd. All rights reserved.
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1 page  
KLMxGxxEHx
datasheet
Draft Rev. 0.0
moviNAND
3.0 PACKAGE CONFIGURATIONS
3.1 Pin Configuration
11.5mm x 13mm x 1.2mm(Max)
Pin NO
Name
Pin NO
C6
VDD
H10
P3
VDD
K8
P5
VDD
E7
M4
VDD
P6
N4
VDD
G5
J10
VDDF
N5
K9
VDDF
C4
E6
VDDF
P4
F5
VDDF
N2
C2
VDDI
A3
M5
CMD
A4
M6 CLK A5
B2
B3
B4
B5
B6
Name
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
DAT0
DAT1
DAT2
DAT3
DAT4
DAT5
DAT6
DAT7
DNU
DNU
DNU
DNU
DNU
DNU
1 2 3 4 5 6 7 8 9 10 11 12 13 14
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DAT0 DAT1 DAT2
A
DAT3 DAT4 DAT5 DAT6 DAT7
B
VDDI Vss VDD
C
D
VDDF Vss
E
VDDF
F
Vss
G
Vss
H
VDDF
J
Vss VDDF
K
L
VDD CMD CLK
M
Vss VDD Vss
N
VDD Vss VDD Vss
P
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
Figure 1. 153-FBGA
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5 Page 
KLMxGxxEHx
datasheet
Draft Rev. 0.0
moviNAND
4.1.3 Change boot partition size
Initial boot partition size in moviNAND is set to zero. However, the boot partition size is allowed to be changed by user. Boot partition size changing
sequence is following the sequence Figure 4-2 below. Argument of the third CMD62 can be set boot partition size. It can be calculated by this equation.
Argument (Boot Size) =(Number of Super Block for boot partition) / 2
For example, if user wants 10 super blocks for boot partition, argument of third CMD62 should be 0x5.
Detail values of moviNAND are referred to below Table.
After setting the boot partition size, all of data in the moviNAND is removed. And the value of EXT_CSD [227:226] and SEC_COUNT is automatically
changing. So user should be careful changing boot partition size.
Command 62 (ARG: 0xEFAC62EC)
Command 62 (ARG: 0x00CBAEA7)
Command 62 (ARG: Boot Size)
Wait Busy Clear
Density
1GB
2GB
8GB
16GB
Figure 6. Boot Partition Size Changing Sequence
Super Block Size
1MB
1MB
4MB
4MB
MAX Boot Partition Size
256MB
256MB
1024MB
1024MB
Max argument value
128
128
128
128
4.1.4 Timing in Boot Mode
SAMSUNG moviNAND needs Min.50ms time(tDELAY) to start boot mode right after power-up. This time(tDELAY) includes normal boot mode as well as
alternative boot mode.
If host does not wait the time(tDELAY) for boot mode , hosts may experience timeout because tBA would be out of spec.
VDD
VDDF
CLK
CMD
CMD1 RESP CMD2 RESP CMD3 RESP
DAT[0]
S 010 E
tBA
tDELAY Max
50ms
Min
50ms
tBD
1 sec Max
S 512bytes E
+CRC
S 512bytes E
+CRC
Boot terminated
Min 8 clocks + 48 clocks = 56 clocks required from
CMD signal high to next MMC command.
Figure 7. MultiMediaCard state diagram & timing (boot mode)
- 11 -
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