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PDF FDP027N08B Data sheet ( Hoja de datos )

Número de pieza FDP027N08B
Descripción N-Channel PowerTrench MOSFET
Fabricantes Fairchild Semiconductor 
Logotipo Fairchild Semiconductor Logotipo



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FDP027N08B
N-Channel PowerTrench® MOSFET
80 V, 223 A, 2.7 mΩ
November 2013
Features
• RDS(on) = 2.21 mΩ ( Typ.) @ VGS = 10 V, ID = 100 A
• Low FOM RDS(on) * QG
• Low Reverse-Recovery Charge, Qrr = 112 nC
• Soft Reverse-Recovery Body Diode
• Enables High Efficiency in Synchronous Rectification
• Fast Switching Speed
• 100% UIL Tested
• RoHS Compliant
Description
This N-Channel MOSFET is produced using Fairchild Semicon-
ductor’s PowerTrench® process that has been tailored to mini-
mize the on-state resistance while maintaining superior
switching performance.
Applications
• Synchronous Rectification for ATX / Server / Telecom PSU
• Battery Protection Circuit
• Motor Drives and Uninterruptible Power Supplies
D
GDS TO-220
G
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted.
Symbol
Parameter
FDP027N08B_F102
VDSS
VGSS
ID
IDM
EAS
dv/dt
PD
Drain to Source Voltage
Gate to Source Voltage
Drain Current
Drain Current
- Continuous (TC = 25oC, Silicon Limited)
- Continuous (TC = 100oC, Silicon Limited)
- Continuous (TC = 25oC, Package Limited)
- Pulsed
(Note 1)
Single Pulsed Avalanche Energy
(Note 2)
Peak Diode Recovery dv/dt
Power Dissipation
(TC = 25oC)
- Derate Above 25oC
(Note 3)
80
±20
223*
158*
120
892
917
6.0
246
1.64
TJ, TSTG
Operating and Storage Temperature Range
-55 to +175
TL Maximum Lead Temperature for Soldering, 1/8” from Case for 5 Seconds
300
*Calculated continuous current based on maximum allowable junction temperature. Package limitation current is 120 A.
Unit
V
V
A
A
mJ
V/ns
W
W/oC
oC
oC
Thermal Characteristics
Symbol
RθJC
RθJA
Parameter
Thermal Resistance, Junction to Case, Max.
Thermal Resistance, Junction to Ambient, Max.
FDP027N08B_F102
0.61
62.5
Unit
oC/W
©2011 Fairchild Semiconductor Corporation
FDP027N08B Rev. C4
1
www.fairchildsemi.com

1 page




FDP027N08B pdf
Typical Performance Characteristics (Continued)
Figure 13. Transient Thermal Response Curve
1
0.5
0.1 0.2
0.1
0.05
0.01
0.02
0.01
Single pulse
0.005
10-5
PDM
t1
t2
*Notes:
1. ZθJC(t) = 0.61oC/W Max.
2. Duty Factor, D= t1/t2
3. TJM - TC = PDM * ZθJC(t)
10-4
10-3
10-2
t1R, Reecctatanngguullaar PullsseeDDuurraatitoionn[s[esce]c]
10-1
1
©2011 Fairchild Semiconductor Corporation
FDP027N08B Rev. C4
5
www.fairchildsemi.com

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