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PDF CN3082 Data sheet ( Hoja de datos )
| Número de pieza | CN3082 | |
| Descripción | Multi-Chemistry Battery Charger | |
| Fabricantes | CONSONANCE | |
| Logotipo |  |
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如韵电子 CONSONANCE
Multi-Chemistry Battery Charger for Solar-Powered Systems
CN3082
General Description:
CN3082 is a mutli-chemistry battery charge control
chips for single cell lithium batteries, lithium iron
phosphate and single or two to four nickel-metal
hydride batteries. The device contains an on-chip
power MOSFET and eliminates the need for the
external sense resistor and blocking diode. CN3082
is specifically designed to work within USB power
specifications. Thermal feedback regulates the
charge current to limit the die temperature during
high power operation or high ambient temperature.
Chip integrates a high-precision voltage comparator,
with 1% accuracy, you can accurately set the
constant current charge termination voltage. An
on-chip 8-bit ADC can adjust charging current
automatically based on the output capability of input
power supply, so CN3082 is ideally suited for solar
powered system.
The charge current can be programmed externally
with a single resistor. When the input supply is
removed, the CN3082 automatically enters a low
power sleep mode , dropping the battery drain
current to less than 3uA. Other features include
undervoltage lockout, automatic recharge, battery
temperature sensing and charging/termination
indicator.
The CN3082 is available in 8-pin SOP8 package.
Applications:
Cell Phone
Digital Camera
Electronic Dictionary
Portable Devices
The need for lithium batteries, nickel
metal hydride batteries, lithium iron
phosphate and lead-acid battery charging
Features:
Suitable for the USB port or AC adapter
On-chip Power MOSFET
Constant current charge voltage accuracy of
1%
On-chip 8-bit ADC can adjust charging current
automatically based on the output capability of
input power supply
Suitable for Solar-Powered System
Precharge Conditioning for Reviving Deeply
Discharged Cells and Minimizing Heat
Dissipation During Initial Stage of Charge
Continuous Programmable Charge Current Up
to 1000mA
Constant-Current/Constant-Temperature
Operation with Thermal Regulation to
Maximize Charge Rate Without Risk of
Overheating
Automatic Low-Power Sleep Mode When Input
Supply Voltage is Removed
Status Indication LED drive or MCU interface
Automatic Recharge
Battery Temperature Sensing
Available in SOP-8 Package
Pb-free Available
Pin Assignment
TEMP 1
ISET 2
GND 3
VIN 4
8 FB
CN3082
7 CHRG
6 IMIN
5 BAT
www.consonance-elec.com
REV 1.1
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1 page  
mode. So the battery terminal voltage:
VBAT＝2.445×(1＋R3／R4)
Note: When the FB pin in hand soldering, welding time is shorter, so that this
pin to Continuous a lower temperature.
Absolute Maximum Ratings
All Terminal Voltage……………－0.3V to 6.5V
BAT Short-Circuit Duration………...Continuous
Storage Temperature….............－65℃ to 150℃
Maximum Junction Temperature…...150℃
Operating Temperature…...－40℃ to 85℃
Lead Temperature(10s)…….............260℃
Stresses beyond those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device. These are stress
ratings only and functional operation of the device at these or any other conditions above those indicated in the operational
sections of the specifications is not implied. Exposure to Absolute Maximum Rating Conditions for extended periods may affect
device reliability.
Electrical Characteristics
(VIN=5V, TA=－40℃ to 85℃, Typical Values are measured at TA=25℃,unless otherwise noted))
Parameters
Symbol
Test Conditions
Min Typ Max
Input Supply Voltage VIN
4.45 6
Operating Current IVIN
Undervoltage Lockout Vuvlo
Charge Termination Mode
VIN falling
400 650 950
3.75 4
Undervoltage Lockout
Huvlo
Hysteresis
0.1
BAT pin Current
FB Pin
RISET＝3.9K，
constant current mode
IBAT
RISET＝3.9K，VFB＝0V
VIN=0V，sleep mode
400 500 600
25 50 75
3
Precharge Threshold
Precharge Threshold
Hysteresis
VPRE
HPRE
VFB rising
1.08 1.54
0.1
1.6
Constant Current
Charge Termination
Threshold
Vterm VFB rising
2.42 2.445 2.47
Recharge Threshold
Sleep Mode
VRECH VFB falling
1.6 1.65 1.7
Sleep Mode Threshold
VSLP
VIN from high to low, measures
the voltage (VIN－VBAT)
40
Sleep mode Release
Threshold
VIN from low to high, measures
VSLPR the voltage (VIN－VBAT)
90
ISET Pin
ISET Pin Voltage
VFB<1.54V or VFB>2.445V
VISET 1.54<VFB<2.445V
0.44
2.2
TEMP管脚
High Input Threshold VHIGH The voltage at TEMP increases 77.5 80 82.5
Low Input Threshold VLOW The voltage at TEMP decreases 42.5 45 47.5
Unit
V
uA
V
V
mA
uA
V
V
V
V
mv
mv
V
%VIN
%VIN
REV 1.1
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5 Page 
When not use charging status indicator function，connect
pin to the ground.
VIN Bypass Capacitor CIN
Many types of capacitors can be used for input bypassing, CIN is typically a 10uF capacitor.
For the consideration of the bypass capacitor, please refer to the Application Note AN102 from our website
“http://www.consonance-elec.com/pdf/输入电源滤波电容可能引起的问题.pdf”。
Battery test
CN3082 has no internal battery detection circuit, when the battery is not connected, depending on the connected
load BAT pin status，The BAT pin voltage may be charged to the above set of constant current charge
termination voltage, and even close to the input voltage VIN, which is a normal phenomenon.
Under normal circumstances, it is best not to access the input voltage before and after insert a battery, because
the moment the battery access, will produce instantaneous voltage surge, or BAT pin in between the battery and
the contact resistance, which may affect the CN3082 battery voltage detection.
Board Layout Considerations
1. RISET at ISET pin should be as close to CN3082 as possible, also the parasitic capacitance at ISET pin should
be kept as small as possible.
2. The capacitance at VIN pin and BAT pin should be as close to CN3082 as possible.
3. During charging, CN3082’s temperature may be high, the NTC thermistor should be placed far enough to
CN3082 so that the thermistor can reflect the battery’s temperature correctly.
4. It is very important to use a good thermal PCB board layout to maximize charging current. The thermal path
for the heat generated by the IC is from the die to the copper lead frame through the package lead(especially the
ground lead) to the PCB board copper, the PCB board copper is the heat sink. The footprint copper pads should
be as wide as possible and expand out to larger copper areas to spread and dissipate the heat to the surrounding
ambient. Feedthrough vias to inner or backside copper layers are also useful in improving the overall thermal
performance of the charger. Other heat sources on the board, not related to the charger, must also be considered
when designing a PCB board layout because they will affect overall temperature rise and the maximum charge
current. The ability to deliver maximum charge current under all conditions require that the exposed metal pad
on the back side of the CN3082 package be soldered to the PCB board ground. Failure to make the thermal
contact between the exposed pad on the backside of the package and the copper board will result in larger
thermal resistance.
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11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet CN3082.PDF ] | |
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