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Número de pieza | NCP451 | |
Descripción | 3A Ultra-Small Low Ron and Controlled Load Switch | |
Fabricantes | ON Semiconductor | |
Logotipo | ||
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No Preview Available ! NCP451
3A Ultra-Small Low Ron
and Controlled Load Switch
with Auto-Discharge Path
The NCP451 is a very low Ron MOSFET controlled by external
logic pin, allowing optimization of battery life, and portable device
autonomy.
Indeed, due to a current consumption optimization with NMOS
structure, leakage currents are eliminated by isolating connected IC on
the battery when not used.
Output discharge path is also embedded to eliminate residual
voltages on the output rail.
Proposed in a wide input voltage range from 0.75 V to 5.5 V, in a
small 0.9 x 1.4 mm WLCSP6, pitch 0.5 mm.
Features
• 0.75 V – 5.5 V Operating Range
• 12 mW N MOSFET from 3.6 V to 5.5 V
• 13 mW N MOSFET from 1 V to 3.3 V
• DC Current Up to 3 A
• Output Auto−Discharge
• Active High EN Pin
• WLCSP6 0.9 x 1.4 mm
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
• Mobile Phones
• Tablets
• Digital Cameras
• GPS
• Portable Devices
www.onsemi.com
MARKING
DIAGRAM
WLCSP6
FC SUFFIX
CASE 499BR
XXXXG
AYWW
WLCSP6
AFC SUFFIX
CASE 567KB
XXXXG
AYWW
XXXX = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
PINOUT DIAGRAM
12
A OUT
IN
B OUT
IN
C GND
EN
(Top View)
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 10 of this data sheet.
© Semiconductor Components Industries, LLC, 2015
July, 2015 − Rev. 9
1
Publication Order Number:
NCP451/D
1 page VIN
EN
VOUT
NCP451
TIMINGS
TEN
TR
TON
Figure 3. Enable, Rise and Fall Time
TF
www.onsemi.com
5
5 Page NCP451
PACKAGE DIMENSIONS
WLCSP6, 1.40x0.90
CASE 567KB
ISSUE A
D
PIN A1
REFERENCE
ÈÈ2X 0.25 C
ÈÈÈÈ2X 0.25 C
TOP VIEW
0.10 C
0.05 C
NOTE 3
A1
SIDE VIEW
AB
E
A2
A
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM MIN NOM MAX
A −−− −−− 0.510
A1 0.142 −−− 0.172
A2 −−− 0.320 0.338
b 0.195 −−− 0.235
D −−− 1.400 1.440
E −−− 0.900 0.940
e 0.50 BSC
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
6X b
0.05 C A B
0.03 C
e
1
2
ABC
BOTTOM VIEW
e/2
e
0.50
PITCH A1
6X
0.25
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
11
11 Page |
Páginas | Total 12 Páginas | |
PDF Descargar | [ Datasheet NCP451.PDF ] |
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