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Número de pieza A3R12E30CBF
Descripción 512Mb DDRII Synchronous DRAM
Fabricantes Zentel 
Logotipo Zentel Logotipo



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A3R12E30CBF
A3R12E40CBF
512Mb DDRII Synchronous DRAM
512Mb DDRII SDRAM Specification
A3R12E30CBF
A3R12E40CBF
Zentel Electronics Corp.
Revision 1.2
Sep., 2013

1 page




A3R12E30CBF pdf
CONTENTS
A3R12E30CBF
A3R12E40CBF
512Mb DDRII Synchronous DRAM
Specifications ................................................................................................................................ 1
Features ........................................................................................................................................ 1
Ordering Information ..................................................................................................................... 2
Part Number.................................................................................................................................. 2
Pin Configurations......................................................................................................................... 3
Electrical Specifications................................................................................................................. 5
Block Diagram............................................................................................................................... 24
Pin Function .................................................................................................................................. 25
Command Operation..................................................................................................................... 27
Simplified State Diagram............................................................................................................... 35
Operation of DDR2 SDRAM.......................................................................................................... 36
Package Drawing .......................................................................................................................... 70
Recommended Soldering Conditions ........................................................................................... 72
Revision 1.2
Page 4 / 73
Sep., 2013

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A3R12E30CBF arduino
A3R12E30CBF
A3R12E40CBF
512Mb DDRII Synchronous DRAM
DC Characteristics 2 (TC = 0°C to + 85°C, VDD, VDDQ = 1.8V ± 0.1V)
Parameter
Symbol Value
Unit Notes
Input leakage current
|ILI| 2
μA VSS VIN VDD
Output leakage current
|ILO|
5
μA VSSQ VOUT VDDQ
Output timing measurement reference level VOTR 0.5 x VDDQ V 1
Output minimum sink DC current
IOL +13.4
mA 3, 4, 5
Output minimum source DC current
IOH -13.4
mA 2, 4, 5
Notes: 1. The VDDQ of the device under test is reference.
2.VDDQ = 1.7V; VOUT = 1.42V.
3.VDDQ = 1.7V; VOUT = 0.28V.
4.The DC value of VREF applied to the receiving device is expected to be set to VTT.
DC Characteristics 3 (TC = 0°C to + 85°C, VDD, VDDQ = 1.8V ± 0.1V)
Parameter
Symbol min
max
AC differential input voltage
VID (AC) 0.5
VDDQ + 0.6
AC differential cross point voltage VIX (AC) 0.5 x VDDQ - 0.175 0.5xVDDQ + 0.175
AC differential cross point voltage VOX (AC) 0.5 x VDDQ - 0.125 0.5xVDDQ + 0.125
Unit Notes
V 1,2
V2
V3
Notes:1. VID (AC) specifies the input differential voltage |VTR - VCP| required for switching, where
VTR is the true input signal (such as CK, DQS) and VCP is the complementary input signal
(such as/CK,/DQS). The minimum value is equal to VIH (AC) - VIL (AC).
2.The typical value of VIX (AC) is expected to be about 0.5 x VDDQ of the transmitting device
and VIX (AC) is expected to track variations in VDDQ. VIX (AC) indicates the voltage at which
differential input signals must cross.
3.The typical value of VOX (AC) is expected to be about 0.5 x VDDQ of the transmitting device
and VOX (AC) is expected to track variations in VDDQ. VOX (AC) indicates the voltage at
which differential output signals must cross.
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Sep., 2013

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