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Número de pieza | DP1608-A2455DE | |
Descripción | Multilayer Chip Diplexers | |
Fabricantes | Advanced Ceramic X | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de DP1608-A2455DE (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
No Preview Available ! DP 1608 Series
Multilayer Chip Diplexers
Features
Monolithic structure including one low-pass and
one band-pass filters with loss pole at adjacent
passband.
RoHS compliant
Applications
Dual-band / dual-mode 2.4GHz/5GHz WLAN
ACX
Advanced Ceramic X
Specifications
Part Number
Passband
(MHz)
Insertion Loss
(dB)
Passband
VSWR
Attenuation
(dB)
DP1608
-A2455DE_
2400~2500
4900~5900
Q’ty/Reel (pcs)
Operating Temperature Range
Storage Temperature Range
Storage Period
Power Capacity
1.2 max.
2.0 max.
1.2 max.
2.0 max.
: 4,000
: -40 ~ +85 oC
: +5 ~ +35 oC, Humidity 45~75%RH
: 12 months max.
: 2W max.
28 min. @ 4.8 ~ 5.0 GHz
18 min. @ 7.2 ~ 7.5GHz
25 min. @ 2.4 ~ 2.5 GHz
20 min. @ 9.8 ~ 11.8GHz
Part Number
DP 1608 - A 2455 DE /LF
Type
DP : Diplexer Dimensions ( L × W ) 1.6 × 0.8 mm
Material Code
A
Specification Code DE
Soldering
LF=lead-free
Frequency Range
Packaging
2455=2400MHz/5500MHz
T: Tape & Reel
B: Bulk
DP1608-A2455DET/LF REV:2 PAGE:1/7
1 page Peel-off Force
Peeling Direction
<100
Top Cover Tape
Carrier Tape
Peel-off force should be in the range of 0.1 – 0.6 N at a peel-off speed of 300±10 mm/min .
ACX
Advanced Ceramic X
Storage Conditions
(1) Temperature: 15 ~35℃, relative humidity (RH): 45~75%.
(2) Non-corrosive environment.
Notes
The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery
conditions when placing your order.
DP1608-A2455DET/LF REV:2 PAGE:5/7
5 Page |
Páginas | Total 7 Páginas | |
PDF Descargar | [ Datasheet DP1608-A2455DE.PDF ] |
Número de pieza | Descripción | Fabricantes |
DP1608-A2455DE | Multilayer Chip Diplexers | Advanced Ceramic X |
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