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PDF IRF9388TRPbF Data sheet ( Hoja de datos )

Número de pieza IRF9388TRPbF
Descripción HEXFET Power MOSFET
Fabricantes International Rectifier 
Logotipo International Rectifier Logotipo



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VDS
VGS max
RDS(on) max
(@VGS = -10V)
ID
(@TA = 25°C)
-30
±25
11.9
-12
V
V
mΩ
A
6
6
6
*
PD - 97521
IRF9388PbF
HEXFET® Power MOSFET
'
'
'
'
SO-8
Applications
Adaptor Input Switch for Notebook PC
Features and Benefits
Features
25V VGS max
Industry-Standard SO8 Package
RoHS Compliant Containing no Lead, no Bromide and no Halogen
Resulting Benefits
Direct Drive at High VGS
Multi-Vendor Compatibility
Environmentally Friendlier
Orderable part number
IRF938 8Pb F
IRF938 8TRPb F
Package Type
SO8
SO8
Standard Pack
For m
Quantity
Tu be/B ulk
95
Tape and Reel
4 000
Note
Absolute Maximum Ratings
Parameter
VDS Drain-to-Source Voltage
VGS
ID @ TA = 25°C
ID @ TA = 70°C
IDM
PD @TA = 25°C
PD @TA = 70°C
Gate-to-Source Voltage
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
cPulsed Drain Current
fPower Dissipation
fPower Dissipation
Linear Derating Factor
TJ
TSTG
Operating Junction and
Storage Temperature Range
Notes  through † are on page 2
www.irf.com
Max.
-30
± 25
-12
-9.6
-96
2.5
1.6
0.02
-55 to + 150
Units
V
A
W
W/°C
°C
1
6/4/10

1 page




IRF9388TRPbF pdf
50
ID = -12A
40
30
20 TJ = 125°C
10
0
0
TJ = 25°C
5 10 15 20
-V GS, Gate -to -Source Voltage (V)
Fig 12. On-Resistance vs. Gate Voltage
500
ID
TOP -2.3A
400 -3.3A
BOTTOM -9.6A
300
200
100
0
25 50 75 100 125 150
Starting TJ , Junction Temperature (°C)
Fig 14. Maximum Avalanche Energy vs. Drain Current
IRF9388PbF
60
50
40
30
20 VGS = -4.5V
10
VGS = -10V
0
0 10 20 30 40 50 60
-ID, Drain Current (A)
Fig 13. Typical On-Resistance vs. Drain Current
1000
800
600
400
200
0
1E-5
1E-4
1E-3
1E-2
Time (sec)
1E-1
Fig 16. Typical Power vs. Time
1E+0
D.U.T * +
ƒ Circuit Layout Considerations
Low Stray Inductance
-
Ground Plane
Low Leakage Inductance
+ Current Transformer
‚
-
-„ +

RG
di/dt controlled by RG
Driver same type as D.U.T.
VDD
+
ISD controlled by Duty Factor "D"
-
D.U.T. - Device Under Test
* Reverse Polarity of D.U.T for P-Channel
Driver Gate Drive
P.W.
Period
D=
P.W.
Period
*VGS=10V
D.U.T. ISD Waveform
Reverse
Recovery
Current
Body Diode Forward
Current
di/dt
D.U.T. VDS Waveform
Diode Recovery
dv/dt
Re-Applied
Voltage
Body Diode
IInnductorr CCuurrernetnt
Forward Drop
Ripple 5%
* VGS = 5V for Logic Level Devices
VDD
ISD
Fig 17. Diode Reverse Recovery Test Circuit for P-Channel HEXFET® Power MOSFETs
www.irf.com
5

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