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PDF BC51PAS Data sheet ( Hoja de datos )
| Número de pieza | BC51PAS | |
| Descripción | 1A PNP medium power transistors | |
| Fabricantes | NXP Semiconductors | |
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BC51PAS; BC52PAS; BC53PAS
45 V/60 V/80 V, 1 A PNP medium power transistors
Rev. 1 — 19 June 2015
Product data sheet
1. Product profile
1.1 General description
PNP medium power transistor series encapsulated in an ultra thin DFN2020D-3
(SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium
power capability and visible and solderable side pads.
Table 1. Product overview
Type number[1]
Package
BC51PAS
DFN2020D-3
BC52PAS
BC53PAS
SOT1061D
NPN complement
BC54PAS
BC55PAS
BC56PAS
[1] Valid for all available selection groups.
1.2 Features and benefits
High collector current capability
Three current gain selections
IC and ICM
Reduced Printed-Circuit Board (PCB) Leadless very small SMD plastic
area requirements
package with medium power capability
Exposed heat sink for excellent thermal Suitable for Automatic Optical
and electrical conductivity
Inspection (AOI) of solder joint
AEC-Q101 qualified
1.3 Applications
Linear voltage regulators
Battery driven devices
MOSFET drivers
High-side switches
Power management
Amplifiers
1.4 Quick reference data
Table 2. Quick reference data
Tamb = 25 C unless otherwise specified
Symbol Parameter
Conditions
VCEO
collector-emitter voltage open base
BC51PAS series
BC52PAS series
BC53PAS series
Min Typ Max Unit
- - 45 V
- - 60 V
- - 80 V
1 page  
NXP Semiconductors
BC51PAS; BC52PAS; BC53PAS
45 V/60 V/80 V, 1 A PNP medium power transistors
6. Thermal characteristics
Table 7.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from junction to ambient
Rth(j-sp)
thermal resistance from junction to solder point
Conditions
in free air
in free air
Max
[1] 298
[2] 154
[3] 151
[4] 114
[5] 76
20
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 1 cm2.
[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm2.
[5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and mounting pad for collector 1 cm2
Unit
K/W
K/W
K/W
K/W
K/W
K/W
=WK MD
.:
GXW\F\FOH
DDF
WS V
FR4 PCB, single-sided copper, tin-plated and standard footprint
Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration for; typical values
BC51_52_53PAS_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 19 June 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
5 of 15
5 Page 
NXP Semiconductors
10. Soldering
BC51PAS; BC52PAS; BC53PAS
45 V/60 V/80 V, 1 A PNP medium power transistors
Footprint information for reflow soldering of DFN2020D-3 package
SOT1061D
2.1
1.7
1.3
0.4 (2x)
0.3 (2x)
0.5 (2x)
0.25
1.1
0.35 0.3
2.5 2.3
0.25
0.5 (2x) 0.6 (2x) 0.7 (2x)
0.25
1
1.1 1.2
0.3
0.4
0.5
1.5
1.6
1.7
occupied area
solder resist
solder lands
solder paste
Dimensions in mm
Issue date
14-03-05
14-03-12
Fig 12. Reflow soldering footprint DFN2020D-3 (SOT1061D)
BC51_52_53PAS_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 19 June 2015
0.35 0.35 0.35
sot1061d_fr
© NXP Semiconductors N.V. 2015. All rights reserved.
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