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PDF UPD4564163 Data sheet ( Hoja de datos )

Número de pieza UPD4564163
Descripción 64M-bit Synchronous DRAM
Fabricantes NEC 
Logotipo NEC Logotipo



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DATA SHEET
MOS INTEGRATED CIRCUIT
µPD4564441, 4564841, 4564163
64M-bit Synchronous DRAM
4-bank, LVTTL
Description
The µPD4564441, 4564841, 4564163 are high-speed 67,108,864-bit synchronous dynamic random-access
memories, organized as 4,194,304 × 4 × 4, 2,097,152 × 8 × 4, 1,048,576 ×16 × 4 (word × bit × bank), respectively.
The synchronous DRAMs achieved high-speed data transfer using the pipeline architecture.
All inputs and outputs are synchronized with the positive edge of the clock.
The synchronous DRAMs are compatible with Low Voltage TTL (LVTTL).
These products are packaged in 54-pin TSOP (II).
Features
Fully Synchronous Dynamic RAM, with all signals referenced to a positive clock edge
Pulsed interface
Possible to assert random column address in every cycle
Quad internal banks controlled by A12 and A13 (Bank Select)
Byte control (×16) by LDQM and UDQM
Programmable Wrap sequence (Sequential / Interleave)
Programmable burst length (1, 2, 4, 8 and full page)
Programmable /CAS latency (2 and 3)
Automatic precharge and controlled precharge
CBR (auto) refresh and self refresh
• ×4, ×8, ×16 organization
Single 3.3 V ± 0.3 V power supply
LVTTL compatible inputs and outputs
4,096 refresh cycles / 64 ms
Burst termination by Burst stop command and Precharge command
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. M12621EJCV0DS00 (12th edition)
Date Published January 2000 NS CP (K)
Printed in Japan
The mark shows major revised points.
©
1997

1 page




UPD4564163 pdf
µPD4564441, 4564841, 4564163
[µPD4564841]
54-pin Plastic TSOP (II) (10.16mm (400))
2M words × 8 bits × 4 banks
VCC
DQ0
VCCQ
NC
DQ1
VSSQ
NC
DQ2
VCCQ
NC
DQ3
VSSQ
NC
VCC
NC
/WE
/CAS
/RAS
/CS
A13
A12
A10
A0
A1
A2
A3
VCC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
54 Vss
53 DQ7
52 VssQ
51 NC
50 DQ6
49 VccQ
48 NC
47 DQ5
46 VssQ
45 NC
44 DQ4
43 VccQ
42 NC
41 Vss
40 NC
39 DQM
38 CLK
37 CKE
36 NC
35 A11
34 A9
33 A8
32 A7
31 A6
30 A5
29 A4
28 Vss
A0 to A13 Note : Address inputs
DQ0 to DQ7 : Data inputs / outputs
CLK : Clock input
CKE
: Clock enable
/CS : Chip select
/RAS
: Row address strobe
/CAS
: Column address strobe
/WE : Write enable
DQM
: DQ mask enable
VCC : Supply voltage
VSS : Ground
VCCQ
: Supply voltage for DQ
VSSQ
: Ground for DQ
NC : No connection
Note A0 to A11 : Row address inputs
A0 to A8 : Column address inputs
A12, A13 : Bank select
Data Sheet M12621EJCV0DS00
5

5 Page





UPD4564163 arduino
µPD4564441, 4564841, 4564163
2. Commands
Mode register set command
(/CS, /RAS, /CAS, /WE = Low)
The µPD4564xxx has a mode register that defines how the device
operates. In this command, A0 through A13 are the data input pins.
After power on, the mode register set command must be executed to
initialize the device.
The mode register can be set only when all banks are in idle state.
During 2 CLK (tRSC) following this command, the µPD4564xxx cannot
accept any other commands.
Fig.1 Mode register set command
CLK
CKE
/CS
/RAS
/CAS
/WE
A12, A13
A10
Add
H
Activate command
(/CS, /RAS = Low, /CAS, /WE = High)
The µPD4564xxx has four banks, each with 4,096 rows.
This command activates the bank selected by A12 and A13 (BS) and a
row address selected by A0 through A11.
This command corresponds to a conventional DRAM’s /RAS falling.
Fig.2 Row address strobe and
bank activate command
CLK
CKE
/CS
/RAS
/CAS
/WE
A12, A13
(Bank select)
A10
Add
H
Row
Row
Precharge command
(/CS, /RAS, /WE = Low, /CAS = High)
This command begins precharge operation of the bank selected by
A12 and A13 (BS). When A10 is High, all banks are precharged,
regardless of A12 and A13. When A10 is Low, only the bank selected
by A12 and A13 is precharged.
After this command, the µPD4564xxx can’t accept the activate
command to the precharging bank during tRP (precharge to activate
command period).
This command corresponds to a conventional DRAM’s /RAS rising.
Data Sheet M12621EJCV0DS00
Fig.3 Precharge command
CLK
CKE
/CS
/RAS
/CAS
/WE
A12, A13
(Bank select)
A10
(Precharge select)
Add
H
11

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