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Número de pieza | TGF2120 | |
Descripción | 1200um Discrete GaAs pHEMT | |
Fabricantes | TriQuint Semiconductor | |
Logotipo | ||
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Defense & Aerospace
High-Reliability
Test and Measurement
Commercial
Broadband Wireless
TGF2120
1200um Discrete GaAs pHEMT
Product Features
Frequency Range: DC - 20 GHz
31 dBm Typical Output Power - P1dB
11 dB Typical Gain @ 12 GHz
57% Typical PAE @ 12 GHz
No Vias
Technology: 0.25 um GaAs pHEMT
Chip Dimensions: 0.41 x 0.54 x 0.10 mm
Functional Block Diagram
General Description
The TriQuint TGF2120 is a discrete 1200-Micron pHEMT
which operates from DC to 20 GHz. The TGF2120 is
designed using TriQuint’s proven standard 0.25um
power pHEMT production process. This process
features advanced techniques to optimize microwave
power and efficiency at high drain bias operating
conditions.
The TGF2120 typically provides 31 dBm of output power
at P1dB with gain of 11 dB and 57% power-added
efficiency at 1 dB compression. This performance
makes the TGF2120 appropriate for high efficiency
applications. The protective overcoat layer with silicon
nitride provides a level of environmental robustness and
scratch protection.
Lead-free and RoHS compliant.
Pad Configuration
Pad Dimensions
G (71um X 71um)
D (71um X 71um)
S (113.8um X 71um)
S (113.8um X 106um)
Terminals
Gate
Drain
Source (outermost)
Source (center)
Ordering Information
Part
TGF2120
ECCN
EAR99
Description
1200um GaAs pHEMT
Datasheet: Rev A 06-13-13
© 2013 TriQuint
- 1 of 6-
Disclaimer: Subject to change without notice
www.triquint.com
1 page Assembly Notes
TGF2120
1200um Discrete GaAs pHEMT
Component placement and adhesive attachment assembly notes:
Vacuum pencils and/or vacuum collets are the preferred method of pick up.
Air bridges must be avoided during placement.
The force impact is critical during auto placement.
Organic attachment (i.e. epoxy) can be used in low‐power applications.
Curing should be done in a convection oven; proper exhaust is a safety concern.
Reflow process assembly notes:
Recommend Eutectic die attach with AuSn (80/20) solder and limit exposure to temperatures above 300C to 30
seconds, maximum.
An alloy station or conveyor furnace with reducing atmosphere should be used.
Do not use any kind of flux.
Coefficient of thermal expansion matching is critical for long‐term reliability.
Devices must be stored in a dry nitrogen atmosphere.
Interconnect process assembly notes:
Either Thermo‐compression Wedge Bonding or Thermosonic Ball Bonding can be used to bond onto the die.
Force, time, and ultrasonics are critical bonding parameters.
Aluminum wire should not be used.
Devices with small pad sizes should be bonded with 0.0008‐inch wire.
Product Compliance Information
ESD Sensitivity
Caution – ESD Sensitive Device
Proper ESD procedures should be followed when
handling this device.
Not HAST Compliant.
RoHs Compliance
This part is compliant with EU 2002/95/EC RoHS
directive (Restrictions on the Use of Certain Hazardous
Substances in Electrical and Electronic Equipment).
This product also has the following attributes:
Lead Free
Halogen Free (Chlorine, Bromine)
Antimony Free
TBBP-A (C15H12Br402) Free
PFOS Free
SVHC Free
Datasheet: Rev A 06-13-13
© 2013 TriQuint
- 5 of 6-
Disclaimer: Subject to change without notice
www.triquint.com
5 Page |
Páginas | Total 6 Páginas | |
PDF Descargar | [ Datasheet TGF2120.PDF ] |
Número de pieza | Descripción | Fabricantes |
TGF2120 | 1200um Discrete GaAs pHEMT | TriQuint Semiconductor |
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