DataSheet.es    


PDF BD35390FJ Data sheet ( Hoja de datos )

Número de pieza BD35390FJ
Descripción Termination Regulator
Fabricantes ROHM Semiconductor 
Logotipo ROHM Semiconductor Logotipo



Hay una vista previa y un enlace de descarga de BD35390FJ (archivo pdf) en la parte inferior de esta página.


Total 19 Páginas

No Preview Available ! BD35390FJ Hoja de datos, Descripción, Manual

Datasheet
1.0V to 5.5V, 1A 1ch
Termination Regulator for DDR-SDRAMs
BD35390FJ
General Description
BD35390FJ is a termination regulator that complies with
JEDEC requirements for DDR1/2/3-SDRAM. This linear
power supply uses a built-in N-channel MOSFET and
high-speed OP-AMPS specially designed to provide
excellent transient response. It has a sink/source
current capability up to 1A and has a power supply bias
requirement of 3.3V to 5.0V for driving the N-channel
MOSFET. By employing an independent reference
voltage input (VDDQ) and a feedback pin (VTTS), this
termination regulator provides excellent output voltage
accuracy and load regulation as required by JEDEC
standards.
Key Specifications
Termination Input Voltage Range:
1.0V to 5.5V
VCC Input Voltage Range:
2.7V to 5.5V
VDDQ Reference Voltage Range: 1.0V to 2.75V
Output Current:
1.0A (Max)
Output Current (Pulse):
3.0A (Max)
High side FET ON-Resistance:
0.35(Typ)
Low side FET ON-Resistance:
0.35(Typ)
Standby Current:
0.5mA (Typ)
Operating Temperature Range: -30°C to +100°C
Package
W(Typ) x D(Typ) x H(Max)
Features
Incorporates a Push-Pull Power Supply for
Termination (VTT)
Incorporates an Enabler
Incorporates an Under Voltage Lockout (UVLO)
Incorporates a Thermal Shutdown Protector (TSD)
Compatible with Dual Channel (DDR1, DDR2,
DDR3)
Incorporates PGOOD Function
SOP-J8
4.90mm x 6.00mm x 1.65mm
Applications
Power Supply for DDR 1/2/3/4 - SDRAM
Power Supply for GDDR 1/2/3/4/5 - SDRAM
Power Supply for LPDDR 1/2/3/4 - SDRAM
Typical Application Circuit, Block Diagram
VCC
C3
VDDQ
VCC
6
VDDQ
5
Reference
Block
VCC
UVLO
SOFT
TSD
EN
UVLO
Enable EN
4
Thermal TSD
Protection
EN
VTT_IN
C5
VTT_IN
7
VCC
TSD
EN
VCC UVLO
TSD
EN
UVLO
Delay
Logic
VTT
8
C7
3
VTTS
1
PGOOD
VTT
R1
2
GND
Product structureSilicon monolithic integrated circuit
.www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ2211114001
This product has no designed protection against radioactive rays
1/16
TSZ02201-0J1J0A900720-1-2
07.Mar.2014 Rev.001

1 page




BD35390FJ pdf
BD35390FJ
Typical Performance Curves
Datasheet
1050
1000
950
900
1400
1350
1300
1250
850
800
750
-2
-1.5
-1 -0.5 0 0.5
1 1.5
Output Current : ITT (A)
2
Figure 1. Termination Output Voltage vs Output Current
(DDR2)
1200
1150
1100
-2 -1.5
-1 -0.5
0 0.5
1
Output Current : ITT (A)
1.5
2
Figure 2. Termination Output Voltage vs Output Current
(DDR1)
900
850
800
750
700
650
600
-2
-1.5
-1 -0.5
0 0.5
1
Output Current : ITT (A)
1.5
2
Figure 3. Termination Output Voltage vs Output Current
(DDR3)
www.rohm.co.jp
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
5/16
TSZ02201-0J1J0A900720-1-2
07.Mar.2014 Rev.001

5 Page





BD35390FJ arduino
BD35390FJ
Datasheet
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital
and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block.
Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the
capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on
the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the
IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of
connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned OFF completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Terminals
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the power
supply or ground line.
www.rohm.co.jp
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
11/16
TSZ02201-0J1J0A900720-1-2
07.Mar.2014 Rev.001

11 Page







PáginasTotal 19 Páginas
PDF Descargar[ Datasheet BD35390FJ.PDF ]




Hoja de datos destacado

Número de piezaDescripciónFabricantes
BD35390FJTermination RegulatorROHM Semiconductor
ROHM Semiconductor

Número de piezaDescripciónFabricantes
SLA6805M

High Voltage 3 phase Motor Driver IC.

Sanken
Sanken
SDC1742

12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters.

Analog Devices
Analog Devices


DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares,
permitiéndote verlos en linea o descargarlos en PDF.


DataSheet.es    |   2020   |  Privacy Policy  |  Contacto  |  Buscar