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PDF BD3574YHFP Data sheet ( Hoja de datos )

Número de pieza BD3574YHFP
Descripción High Voltage LDO Regulators
Fabricantes ROHM Semiconductor 
Logotipo ROHM Semiconductor Logotipo



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Datasheet
Single-Output LDO Regulators
High Voltage LDO Regulators
BD357xYFP-M BD357xYHFP-M Series
General Description
BD357xYFP-M BD357xYHFP-M Series regulators feature a high withstand voltage (50 V) and are suitable to use with
onboard vehicle microcontrollers. They offer an output current of 500 mA while limiting the quiescent current to 30 µA (Typ).
With these devices, a ceramic capacitor may be used at the output for stable operation. The output tolerance is within ±2 %
over their operating temperature range (-40 °C to +125 °C). The short circuit protection is folded-type to minimize generation
of heat during malfunction. These devices are developed to offer the most robust power supply design under harsh
automotive environments. The BD357xYFP-M BD357xYHFP-M Series provide an ideal solution to lower current
consumption as well as to simplify the use with battery direct-coupled systems.
Features
Low-Saturation Voltage Type P-Channel DMOS
Output Transistors
High Output Voltage Precision: ±2 %
(lo = 200 mA)
Low-ESR Ceramic Capacitors can be used as
Output Capacitors.
VCC Power Supply Voltage = 50 V
Built-in Overcurrent Protection Circuit and Thermal
Shutdown Circuit
Key Specifications
Recommended VCC Power Supply Voltage: 36 V (Max)
Output Voltage Type:
Fixed / Variable
Output Current:
500 mA (Max)
Low Quiescent Current:
30 µA (Typ)
Operating Temperature Range:
-40 °C to +125 °C
Packages
W (Typ) x D (Typ) x H (Max)
TO252-3
TO252-5
6.50 mm x 9.50 mm x 2.50 mm 6.50 mm x 9.50 mm x 2.50 mm
Applications
Onboard Vehicle Devices (Body Control, Car Stereos,
Satellite Navigation Systems, etc.)
HRP5
9.395mm x 10.540mm x 2.005mm
Ordering Information
BD 3 5 7 x Y x F P-
Mxx
Part Number
Lineup
Package
FP: TO252-3 / 5
HFP: HRP5
Packaging and forming specification
E2: Embossed tape and reel (TO252-3 / 5)
TR: Embossed tape and reel (HRP5)
Output Voltage
Switch
Package
Orderable Part Number
3.3 V
5.0 V
Variable
3.3 V
5.0 V
Variable
Not Included
Included
TO252-3
HRP5
TO252-3
HRP5
TO252-5
HRP5
TO252-5
HRP5
TO252-5
HRP5
TO252-5
HRP5
Reel of 2000
Reel of 2000
Reel of 2000
Reel of 2000
Reel of 2000
Reel of 2000
BD3570YFP-ME2
BD3570YHFP-MTR
BD3571YFP-ME2
BD3571YHFP-MTR
BD3572YFP-ME2
BD3572YHFP-MTR
BD3573YFP-ME2
BD3573YHFP-MTR
BD3574YFP-ME2
BD3574YHFP-MTR
BD3575YFP-ME2
BD3575YHFP-MTR
Product structure : Silicon monolithic integrated circuit
.www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 14 • 001
This product has no designed protection against radioactive rays
1/17
TSZ02201-0T2T0AN00160-1-2
19.Sep.2013 Rev.002

1 page




BD3574YHFP pdf
BD357xYFP-M BD357xYHFP-M Series
Typical Performance Curves
BD3574YHFP-MUnless otherwise specified, Ta = 25 °C, VCC = 13.2 V, SW = 3 V)
Datasheet
50
40 Ta = 125 °C
30
20 Ta = 25 °C
Ta = -40 °C
10
0
0 5 10 15 20 25
Supply Voltage: VCC [V]
6
5
4
Ta = 125 °C
3
Ta = 25 °C
2
Ta = -40 °C
1
0
0 5 10 15 20 25
Supply Voltage: VCC [V]
Figure 4. Circuit Current vs Supply Voltage
(“Total Supply Current”)
Figure 5. Output Voltage vs Supply Voltage
63
5
4 2 Ta = 125 °C
Ta = 125 °C
3
Ta = 25 °C
Ta = 25 °C
2 1 Ta = -40 °C
Ta = -40 °C
1
00
0
500
1000
1500
2000
0 100 200 300 400 500
Output Current: IO [mA]
Output Current: IO [mA]
Figure 6. Output Voltage vs Output Current
Figure 7. Dropout Voltage vs Output Current
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
5/17
TSZ02201-0T2T0AN00160-1-2
19.Sep.2013 Rev.002

5 Page





BD3574YHFP arduino
BD357xYFP-M BD357xYHFP-M Series
Datasheet
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
9. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Terminals
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to
the power supply or ground line.
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
11/17
TSZ02201-0T2T0AN00160-1-2
19.Sep.2013 Rev.002

11 Page







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