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PDF TB62710P Data sheet ( Hoja de datos )

Número de pieza TB62710P
Descripción 8-BIT SHIFT REGISTER / LATCHES & CONSTANT CURRENT SOURCE DRIVERS
Fabricantes Toshiba 
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No Preview Available ! TB62710P Hoja de datos, Descripción, Manual

TB62710P/F/FN
TOAHIBA Bi-CMOS Integrated Circuit Silicon Monolithic
TB62710P, TB62710F, TB62710FN
8-Bit Constant-Current LED Driver for Cathode Common LED
The TB62710P, TB62710F and TB62710FN are specifically
designed for use as LED and LED display (cathode-common)
Constant-current drivers.
The constant-current output circuits can be set up using an
external resistor (IOUT = 90 mA max).
These ICs are monolithic integrated circuits have been
designed using the Bi-CMOS process.
The devices consist of an 8-bit shift register, a latch, an
ANDgate and constant-current drivers.
FEATURES
· Constant-current output:
A single resistor can be used to set any output current in the
range 5~90 mA.
· Maximum clock frequency: fCLK = 15 MHz
(operating while connected in cascade, Topr = 25°C)
· 5-V CMOS compatible input
· Packages:
P-type: DIP20-P-300-2.54A
F-type: SSOP24-P-300-1.00
FN-type: SSOP20-P-225-0.65A
· Constant-output-current accuracy:
Output GND
Voltage
Current accuracy
between bits
between ICs
Output Current
(max)
2.0 V (min)
1.5 V (min)
±6%
±15%
5~90 mA
5~40 mA
TB62710P
TB62710F
TB62710FN
Weight
DIP20-P-300-2.54A: 2.25 g (Typ.)
SSOP24-P-300-1.00: 0.33 g (Typ.)
SSOP20-P-225-0.65A: 0.10 g (Typ.)
1 2002-01-31

1 page




TB62710P pdf
TB62710P/F/FN
Maximum Ratings (Topr = 25°C)
Characteristic
Symbol
Rating
Unit
Supply voltage
Supply voltage for LED
Input voltage
Output current
Output voltage
Clock frequency
VCC terminal current
P-type
(when not mounted)
Power
Dissipation
F-type
(when not mounted)
(Note 3) F-type (on PCB)
FN-type
(when not mounted)
FN-type (on PCB)
P-type
(when not mounted)
F-type
Thermal
(when not mounted)
Resistance
F-type (on PCB)
(Note 3)
FN-type
(when not mounted)
FN-type (on PCB)
Operating Temperature
Storage Temperature
VDD
VLED
VIN
IOUT
VOUT
fCLK
IVCC
Pd1
Pd2
Pd3
Rth (j-a) 1
Rth (j-a) 2
Rth (j-a) 3
Topr
Tstg
0~7.0
0~17.0
-0.4~VDD + 0.4
-90
-0.4~17
15
1440
1.47
0.59
0.83
0.71
0.96
85
210
150
175
130
-40~85
-55~150
V
V
V
mA
V
MHz
mA
W
°C/W
°C
°C
Note 3: P-Type: Powes dissipation is derated by 12.5 mW/°C if device is mounted on PCB and ambient temperature
is above 25°C.
F-Type: Powes dissipation is derated by 6.7 mW/°C if device is mounted on PCB and ambient temperature is
above 25°C.
With device mounted on PCB of 60% Cu and of dimensions 50 mm ´ 50 mm ´ 1.6 mm
FN-Type: Powes dissipation is derated by 7.7 mW/°C if device is mounted on PCB and ambient temperature
is above 25°C.
With device mounted on PCB of 40% Cu and of dimensions 50 mm ´ 50 mm ´ 1.6 mm
5 2002-01-31

5 Page





TB62710P arduino
TB62710P/F/FN
Reference Data (duty curves + package power dissipation)
IOUT – Duty on PCB
80 Topr = 85°C,
70
VCC - VOUT = 2.0 V
Tj = 120°C
60
50
40
30
20
TB62710FN
10 TB62710F
TB62710P
0
0 20 40
60
Duty (%)
80 100
IOUT – Duty on PCB
80
70
60
50
40
30
20
TB62710FN
10 TB62710F
TB62710P
0
0 20 40
Topr = 60°C,
VCC - VOUT = 2.0 V
Tj = 120°C
60 80 100
Duty (%)
IOUT – Duty on PCB
80
70
60
50
40
30
20
TB62710FN
10 TB62710F
TB62710P
0
0 20 40
Topr = 25°C,
VCC - VOUT = 2.0 V
Tj = 120°C
60 80 100
Duty (%)
Pd – Topr
2.0
P-type FREE AIR
1.5
1.0 F-type ON PCB
FN-type ON PCB
0.5
0
0 25 50 75 100
Topr (°C)
90
80 25°C
70
IOUT – REXT
IOUT (mA) =
(1.26 ¸ REXT (W)) ´ 18
60
50
40 Topr = -40°C
85°C
30
20 VDD = 5.0 V,
VCE = 2.0 V,
10 VCC = 17.0 V
0
100
500 1000
REXT (W)
5000 10000
11
2002-01-31

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