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PDF BA12004BF Data sheet ( Hoja de datos )
| Número de pieza | BA12004BF | |
| Descripción | 7 Circuits Darlinton Transistor Array | |
| Fabricantes | ROHM Semiconductor | |
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Datasheet
7 Circuits
Darlinton Transistor Array
BA12003B BA12003BF BA12004B BA12004BF
General Description
BA12003B/BF,BA12004B/BFare darlinton transistor array
consist of 7circuits, input resistor to limit base current and
output surge absorption clamp diode.
Features
■ Built-in 7 circuits
■ High output break down voltage
■ High DC output current gain
■ Built-in input resistor to limit base current
■ Built-in output surge absorption clamp diode
Key Specifications
■ Output break down voltage：
VCE=60V(max)
■ Output current：
Io=500mA/ch(max)
■ Operating supply voltage range： -0.5V to +30V
■ Operating temperature range：
-40°C to +85°C
■ DC current gain：
hfe=1000(min)
■ Input resistor：
BA12003B/BF Rin=2.7kΩ
BA12004B/BF Rin=10.5kΩ
Packages
DIP16
SOP16
W(Typ) x D(Typ) x H(Max)
19.40mm x 6.50mm x 7.95mm
10.00mm x 6.20mm x 1.71mm
Applications
■ Motor Drivers
■ LED Drivers
■ Solenoid Drivers
■ Low Side Switch
Typical Application Circuit
VCC
VCC
DIP16
SOP16
BA12003B / BA12004B BA12003BF / BA12004BF
VCC
16 15 14 13 12 11 10 9
12345678
μCOM
○Product structure: Silicon monolithic integrated circuit
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
○This product has not designed protection against radioactive rays
1/16
TSZ02201-0RCR0GZ00100-1-2
12.May.2015 Rev.002
1 page  
BA12003B BA12003BF BA12004B BA12004BF
Typical Performance Curve (Reference Data)
1.0 10000
0.8
0.6
0.4
0.2
0.0
20
VOUT=60V
40 60 80
Ta[℃]
100
Figure 1 .
Output Leakage Current vs Ambient Temperature
1000
85℃
25℃
100
-40℃
10
1
10 100
Iout[m A]
1000
Figure 2 .
Output DC Current Gain vs Output Current
500
400
85℃
300
200
25℃
-40℃
100
50
100 150
Iin[μA]
200
Figure 3 .
Output Current vs Input Current
2.0
1.6
1.2 25℃
-40℃
0.8 85℃
0.4
100
200 300 400
IOUT[mA]
500
Figure 4 .
Output Saturation Voltage1 vs Output Current
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
5/16
TSZ02201-0RCR0GZ00100-1-2
12.May.2015 Rev.002
5 Page 
BA12003B BA12003BF BA12004B BA12004BF
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
11/16
TSZ02201-0RCR0GZ00100-1-2
12.May.2015 Rev.002
11 Page | ||
| Páginas | Total 19 Páginas | |
| PDF Descargar | [ Datasheet BA12004BF.PDF ] | |
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