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Número de pieza | FFM107-M | |
Descripción | 1.0A Surface Mount Fast Recovery Rectifiers | |
Fabricantes | Crownpo Technology | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de FFM107-M (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
No Preview Available ! FFM101-M THRU FFM107-M
Crownpo Technology
1.0A Surface Mount Fast
Recovery Rectifiers-50-1000V
Features
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
• Low profile surface mounted application in order to
optimize board space.
• Tiny plastic SMD package.
• High current capability.
• Fast switching for high efficiency.
• High surge current capability.
• Glass passivated chip junction.
• Lead-free parts meet RoHS requirments.
• Suffix "-H" indicates Halogen-free parts, ex. FFM101-M-H.
Package outline
SOD-123
0.154(3.9)
0.138(3.5)
0.012(0.3) Typ.
0.075(1.9)
0.060(1.5)
Mechanical data
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123 / MINI SMA
• Terminals :Plated terminals, solderable per MIL-STD-750,
Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.018 gram
0.028(0.7) Typ.
0.067(1.7)
0.051(1.3)
0.028(0.7) Typ.
Dimensions in inches and (millimeters)
Maximum ratings (AT T A=25 oC unless otherwise noted)
PARAMETER
CONDITIONS
Forward rectified current
See Fig.2
Forward surge current
Reverse current
Diode junction capacitance
Storage temperature
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
VR = VRRM TJ = 25 OC
VR = VRRM TJ = 125 OC
f=1MHz and applied 4V DC reverse voltage
Symbol
IO
MIN.
TYP.
MAX. UNIT
1.0 A
IFSM 30 A
5.0
IR
μA
100
CJ 15 pF
T STG
-65
+175 OC
SYMBOLS
V
*1
RRM
(V)
V
*2
RMS
(V)
V
*3
R
(V)
V
*4
F
(V)
FFM101-M
FFM102-M
FFM103-M
FFM104-M
50
100
200
400
35 50
70 100
140 200
280 400
1.30
FFM105-M
FFM106-M
FFM107-M
600
800
1000
420
560
700
600
800
1000
Note 1. Reverse recovery time test condition, IF=0.5A, IR=1.0A, IRR=0.25A
trr *5
(ns)
150
250
500
Operating
temperature
T,J (OC)
-55 to +150
28-Dec-11
Document No. FFM101-M THRU FFM107-M
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
*4 Maximum forward voltage@I=1.F0A
*5 Maximum Reverse recovery time, note 1
www.crownpo.com
1 page FFM101-M THRU FFM107-M
Crownpo Technology
Reel packing
PACKAGE
REEL SIZE
SOD-123
7"
REEL
(pcs)
2,500
COMPONENT
SPACING
(m/m)
4.0
BOX
(pcs)
INNER
BOX
(m/m)
25,000 183*183*123
REEL
DIA,
(m/m)
178
CARTON
SIZE
(m/m)
382*262*387
CARTON
(pcs)
200,000
APPROX.
GROSS WEIGHT
(kg)
9.5
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5oC~40 oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Tp
TP
Ramp-up
TL
Tsmax
TL
Tsmin
tS
Preheat
Ramp-down
Critical Zone
TL to TP
25
t25 oC to Peak
3.Reflow soldering
Time
Profile Feature
Average ramp-up rate(TL to TP)
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(ts)
Tsmax to TL
-Ramp-upRate
Time maintained above:
-Temperature(TL)
-Time(tL)
Peak Temperature(TP)
Time within 5oC of actual Peak
Temperature(tP)
Ramp-down Rate
Time 25oC to Peak Temperature
28-Dec-11
Document No. FFM101-M THRU FFM107-M
Soldering Condition
<3 oC/sec
150oC
200oC
60~120sec
<3oC/sec
217 oC
60~260sec
255 oC-0/+5oC
10~30sec
<6oC/sec
<6minutes
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5 Page |
Páginas | Total 6 Páginas | |
PDF Descargar | [ Datasheet FFM107-M.PDF ] |
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