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PDF BGU7032 Data sheet ( Hoja de datos )

Número de pieza BGU7032
Descripción 1 GHz wideband low-noise amplifier
Fabricantes NXP Semiconductors 
Logotipo NXP Semiconductors Logotipo



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BGU7032
1 GHz wideband low-noise amplifier with bypass
Rev. 2 — 14 September 2010
Product data sheet
1. Product profile
CAUTION
1.1 General description
The BGU7032 MMIC is a wideband amplifier with bypass mode. It is designed specifically
for high linearity, low-noise applications over a frequency range of 40 MHz to 1 GHz. It is
especially suited to Set-Top Box applications.
The LNA is housed in a 6-pin SOT363 plastic SMD package.
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features and benefits
„ Internally biased
„ Programmable between Gp = 10 dB and bypass
„ Flat gain between 40 MHz and 1 GHz
„ Noise figure of 4.5 dB
„ High linearity with an IP3O of 29 dBm
„ 75 Ω input and output impedance
„ Power-down during bypass mode
„ Bypass mode current consumption < 5 mA
„ ESD protection > 2 kV Human Body Model (HBM) on all pins
1.3 Applications
„ Terrestrial and cable Set-Top Boxes (STB)
„ Silicon and “Can” tuners
„ Personal and Digital Video Recorders (PVR and DVR)
„ Home networking and in-house signal distribution

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BGU7032 pdf
NXP Semiconductors
BGU7032
1 GHz wideband low-noise amplifier with bypass
8. Application information
Other applications are possible. Please contact your local sales representative for more
information. Application notes are available on the NXP website.
8.1 Application circuit
VCC
C5 C4
n.c.
R1 = Rbias
X1
RF_IN
C1 6
3 L1
2
1
C2
5 4 C3
X2
RF_OUT
R2
Components are listed in Table 9.
Fig 1. BGU7032 application circuit
CTRL
001aam383
All control and supply lines must be decoupled properly. The decoupling capacitors must
be placed as close to the device as possible.
8.2 Application circuit board layout
RF_IN
X1
R2 C5
C3
C1
C4
R1
L1 C2
BGU7032
Product data sheet
Fig 2.
PCB material = FR4.
PCB thickness = 1.6 mm.
PCB size = 30 mm × 30 mm.
εr = 4.5; thickness of copper layer = 35 μm.
Components are listed in Table 9.
BGU7032 application circuit board layout
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 14 September 2010
X2
RF_OUT
001aam386
© NXP B.V. 2010. All rights reserved.
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BGU7032 arduino
NXP Semiconductors
BGU7032
1 GHz wideband low-noise amplifier with bypass
14. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2
2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3
7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Application information. . . . . . . . . . . . . . . . . . . 5
8.1 Application circuit . . . . . . . . . . . . . . . . . . . . . . . 5
8.2 Application circuit board layout . . . . . . . . . . . . . 5
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8
12 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
12.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
13 Contact information. . . . . . . . . . . . . . . . . . . . . 10
14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 14 September 2010
Document identifier: BGU7032

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