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PDF ZMXM-400 Data sheet ( Hoja de datos )
| Número de pieza | ZMXM-400 | |
| Descripción | MATRIX TRANSCEIVER MODULES | |
| Fabricantes | CEL | |
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MATRIX TRANSCEIVER MODULES
ZMXM-400 Series
Integrated Transceiver Module for ZigBee / IEEE 802.15.4
Evaluation Kits available
DESCRIPTION
The Matrix module is a 2.4 GHz IEEE 802.15.4 RF transceiver providing a cost-
effective solution for data links and wireless networks. The module design is
based on the IEEE 802.15.4 standard and supports peer-to-peer, star,
and mesh networking. The Matrix module is offered with two trans-
mitter output power options, either 10mW or 100mW, providing for
enhanced range performance over standard IEEE 802.15.4/ZigBee
implementations with the integrated power amplifier. Additionally, each
module offers a Dynamic Power Configuration capability giving the ability to
bypass the power amplifier for a 1mW power output when low power operation is
imperative.
The Matrix module consists of the Texas Instruments CC2430, 10mW or 100mW Power Amplifier, and integrated PCB
trace antenna. The module has the option to be populated with a MMCX connector for use with an external cabled
antenna. The module is FCC, IC, and CE certified for fast and simple integration into end applications. The Matrix mod-
ules provide the lowest cost, best in class performance, in a compact form factor.
FEATURES
• Supports LS Research or Z-Stack™ protocols
• Miniature Footprint:
10mW ( 23.4 x 28.7 mm)
100mW (23.4 x 31.2 mm)
• Integrated certified PCB trace antenna
• Optional MMCX connector for external antenna
• 16 RF channels
(Channel 16 operates at reduced power levels)
• Long Range:
10mW - up to 2000 feet
100mW - up to 4000 feet
• Output power software controlled:
1mW - 10mW or
1mW - 100mW
• 17 General Purpose I/O ports
• Windows® Based Test Tools
• Serial UART interface
• Lowest Power Consumption
• Compliance Certification:
10mW - FCC (USA), IC (Canada), and CE (Europe) certification
100mW - FCC (USA) and IC (Canada) certification
• RoHS compliant
The information in this document is subject to change without notice, please confirm data is current
Document No: 0004-00-07-00-000 (Issue C)
Date Published: December 4, 2009
1 page  
ZMXM-400 Series
ANTENNA
The Matrix module includes an integrated PCB trace antenna. An optional configuration with a MMCX connector is also
available. The module regulatory certification has been completed with the PCB trace antenna and also with a Nearson
(part# S131CL-5-RMM-2450S) dipole antenna on a 5 inch cable using the MMCX connection.
The integrated PCB antenna topology is an F-antenna. This antenna is used because it is reasonably compact, has a
fairly omni-directional radiation pattern, good efficiency, and is very simple. An adequate ground plane directly beneath the
module but not under the antenna is necessary to provide good efficiency.
The antenna radiation patterns are dependent upon the carrier board the Matrix module is placed upon. Measured
radiation patterns of the module alone are available by contacting LS Research.
The environment the module is placed in will dictate the range performance. The non-ideal characteristics of the
transmission channel result in the transmitted signal producing reflection, diffraction, and/or scattering. All of these factors
randomly combine to create extremely complex scenarios.
It is also best to keep some clearance between the antenna and nearby objects. This includes how the module is mounted
in the product enclosure. Unless the items on the following list of recommendations are met, the radiation pattern can be
heavily distorted.
• Never place ground plane or copper trace routing underneath the antenna.
• Never place the antenna very close to metallic objects.
• In the final product, ensure that any wiring or other components do not get too close to the antenna.
• The antenna will need a reasonable ground plane area on the mother board area to be efficient.
• Do not use a metallic enclosure or metallized plastic for the antenna.
• Try to keep any plastic enclosure greater than 1 cm from the antenna in any orientation.
POWER AMPLIFIER
Both variants of the Matrix modules contain a Power Amplifier. The Matrix 10 mW (ZMXM-400) has a maximum Power Out
of 10 mW, while the Matrix 100 mW has a maximum Power Out of 100 mW.
The Power Amplifier is controlled via the P1_2 General Purpose I/O (GPIO) of the Texas Instruments CC2430. As such, the
P1_2 GPIO needs to be configured as an output in the application source code to enable control the Power Amplifier.
When P1_2 drives LOW (i.e. logic level ‘0’) the Power Amplifier is disabled and maximum Power Out is 1 mW regardless
of module in use. When P1_2 drives HIGH (i.e. logic level ‘1’) the Power Amplifier is enabled and maximum Power Out is
either 10 mW or 100 mW depending upon which variant of the Matrix module is in use. Intermediate power level settings
(i.e. between 1 mW and 10 or 100 mW) may be achieved by enabling the power amplifier and then varying the Power Out
of the CC2430.
5 Page 
ZMXM-400 Series
PROCESSING (Continued)
Cooling Phase
A controlled cooling phase avoids unwanted metallurgical effects of the solder, and possible mechanical tensions in the
products. Controlled cooling helps achieve the brightest possible solder fillets with a good shape and low contact angle.
• Temperature fall rate: max 3ºC/sec
Pb-Free Soldering Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
The pastes listed in the examples below meet these criteria.
Soldering Paste: Indium 5.1 (Indium Corporation of America)
Alloy Specification: SAC305 - Sn Zinc 96.5%/Ag Silver 3.0%/Cu Copper 0.5%
Alloy Specification: SAC387 - Sn Zinc 95.5%/Ag Silver 3.8%/Cu Copper 0.7%
Melting Temperature: 217ºC
Soldering Paste: LFSOLDER TLF-206-93F (Tamura Kaken [UK] Ltd.)
Alloy Specification: Sn Zinc 95.5%/Ag Silver 3.9%/Cu Copper 0.6%
Melting Temperature: 216-221ºC
The final choice of the soldering paste depends on individual factory approved manufacturing procedures.
Stencil Thickness: 150 µm for host boards
Note: The quality of the solder joints on the castellations (‘half vias’) where they contact the host board should meet
the appropriate IPC specification. See IPC-A-610-12.2.4.
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed
with any cleaning process.
• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and
the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between
neighboring pads. Water could also damage any stickers or labels.
• Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which is
not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
• Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “no clean” soldering paste and eliminate the post soldering cleaning step.
11 Page | ||
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| PDF Descargar | [ Datasheet ZMXM-400.PDF ] | |
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