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PDF 82C251 Data sheet ( Hoja de datos )

Número de pieza 82C251
Descripción PCA82C251
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PCA82C251
CAN transceiver for 24 V systems
Rev. 04 — 25 August 2011
Product data sheet
1. General description
The PCA82C251 is the interface between a CAN protocol controller and the physical bus.
The device provides differential transmit capability to the bus and differential receive
capability to the CAN controller.
2. Features and benefits
Fully compatible with the “ISO 11898-24 V” standard
Slope control to reduce Radio Frequency Interference (RFI)
Thermally protected
Short-circuit proof to battery and ground in 24 V powered systems
Low-current Standby mode
An unpowered node does not disturb the bus lines
At least 110 nodes can be connected
High speed (up to 1 MBd)
High immunity against electromagnetic interference.
3. Applications
High-speed applications (up to 1 MBd) in trucks and busses.
4. Quick reference data
Table 1.
Symbol
VCC
ICC
1/tbit
VCAN
Vdiff
tPD
Tamb
Quick reference data
Parameter
Conditions
supply voltage
supply current
Standby mode
maximum transmission speed
non-return-to-zero
CANH, CANL input/output voltage
differential bus voltage
propagation delay
High-speed mode
ambient temperature
Min Max Unit
4.5 5.5 V
- 275 A
1-
MBd
36 +36 V
1.5 3.0 V
- 50 ns
40 +125 C

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82C251 pdf
NXP Semiconductors
PCA82C251
CAN transceiver for 24 V systems
10. Thermal characteristics
Table 7.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from junction to ambient
Conditions
in free air
Typ Unit
160 K/W
11. Characteristics
Table 8. Characteristics
VCC = 4.5 V to 5.5 V; Tamb = 40 C to +125 C; RL = 60 ; I8 > 10 A; unless otherwise specified; all voltages referenced to
ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design, but only
100 % tested at +25 C.
Symbol Parameter
Conditions
Min Typ Max
Unit
Supply
I3 supply current
dominant; V1 = 1 V; VCC = 5.1 V
dominant; V1 = 1 V; VCC = 5.25 V
dominant; V1 = 1 V; VCC = 5.5 V
recessive; V1 = 4 V; R8 = 47 k
Standby
-
-
-
-
[1] -
- 78
- 80
- 85
- 10
- 275
mA
mA
mA
mA
A
DC bus transmitter
VIH HIGH-level input voltage
output recessive
0.7VCC -
VCC + 0.3 V
VIL LOW-level input voltage
output dominant
0.3 -
0.3VCC V
IIH HIGH-level input current
V1 = 4 V
200 -
+30
A
IIL LOW-level input current
V1 = 1 V
 -
600
A
V6,7 recessive bus voltage
V1 = 4 V; no load
2.0 - 3.0
V
ILO off-state output leakage current 2 V < (V6, V7) < 7 V
2 - +2
mA
5 V < (V6, V7) < 36 V
10 -
+10
mA
V7 CANH output voltage
V1 = 1 V; VCC = 4.75 V to 5.5 V
3.0 - 4.5
V
V1 = 1 V; VCC = 4.5 V to 4.75 V
2.75
4.5
V6 CANL output voltage
V1 = 1 V
0.5 - 2.0
V
V6, 7
difference between output
voltage at pins 6 and 7
V1 = 1 V
V1 = 1 V; RL = 45
1.5 - 3.0
1.5 - -
V
V
V1 = 4 V; no load
500 -
+50
mV
Isc7 short-circuit CANH current
V7 = 5 V
-
-
200
mA
V7 = 36 V
- 100 -
mA
Isc6 short-circuit CANL current
V6 = 36 V
-
- 200
mA
DC bus receiver: V1 = 4 V; pins 6 and 7 externally driven; 2 V < (V6, V7) < 7 V; unless otherwise specified
Vdiff(r)
differential input voltage
(recessive)
7 V < (V6, V7) < 12 V
[2] 1.0
[2] 1.0
-
-
+0.5
+0.4
V
V
Vdiff(d)
differential input voltage
(dominant)
7 V < (V6, V7) < 12 V; not Standby
mode
0.9 - 5.0
1.0 - 5.0
V
V
Standby mode
0.97 -
5.0
V
Standby mode; VCC = 4.5 V to 5.10 V
0.91 -
5.0
V
PCA82C251
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 04 — 25 August 2011
© NXP B.V. 2011. All rights reserved.
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82C251 arduino
NXP Semiconductors
PCA82C251
CAN transceiver for 24 V systems
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
PCA82C251
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 04 — 25 August 2011
© NXP B.V. 2011. All rights reserved.
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