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PDF FTP02N60 Data sheet ( Hoja de datos )

Número de pieza FTP02N60
Descripción 600V N-Channel MOSFET
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No Preview Available ! FTP02N60 Hoja de datos, Descripción, Manual

600V N-Channel MOSFET
General Features
¾ Low ON Resistance
¾ Low Gate Charge (typical 8.9nC)
¾ Fast Switching
¾ 100% Avalanche Tested
¾ RoHS Compliant/Lead Free
FTP02N60/FTA02N60
BVDSS
600V
RDS(ON) (Max.)
4.4
ID
2.2A
Applications
¾ High Efficiency SMPS
¾ Adaptor/Charger
¾ Active PFC
¾ LCD Panel Power
Ordering Information
Part Number Package
FTP02N60
TO-220
FTA02N60
TO-220F
Marking
FTP02N60
FTA02N60
Absolute Maximum Ratings
TC=25unless otherwise specified
Symbol
VDSS
ID
ID@100
IDM
PD
VGS
EAS
dv/dt
TL
Parameter
Drain-to-Source Voltage[1]
Continuous Drain Current
Continuous Drain Current
Pulsed Drain Current, VGS@10V[2]
Power Dissipation
Derating Factor above 25
Gate-to-Source Voltage
Single Pulse Avalanche
Energy L=30mH, ID=2.2A
Peak Diode Recovery dv/dt[3]
Soldering Temperature
Distance of 1.6mm from case for 10 seconds
TJ and TSTG Operating and Storage Temperature Range
FTP02N60
FTA02N60
600
2.2 2.2*
Figure 3
Figure 6
54 21
0.43 0.17
±30
72
4.5
300
-55 to 150
Unit
V
A
W
W/
V
mJ
V/ns
*Drain Current limited by Maximum Junction Temperature.
Caution: Stresses greater than those listed in the “Absolute Maximum Ratings” may cause permanent damage to the device.
Thermal Characteristics
Symbol
RθJC
RθJA
Parameter
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient
FTP02N60
2.3
65
FTA02N60
6.0
65
Unit
/W
ARK Microelectronics Co., Ltd.
w w w. a r k - m i c r o. c o m
1/11
Rev. 2.0 Mar. 2009

1 page




FTP02N60 pdf
FTP02N60/FTA02N60
Figure 6. Maximum Peak Current Capability
100
Transconductance may limit current in this region
10
1
0.00001
0.0001
0.001
tP, Puls0e.0W1 idth(s)
0.1
1
10
4
3.5
3
2.5
2
1.5
1
0.5
0
3
Figure 7. Typical Transfer Characteristics
-55
25
150
4567
VGS, Gate-to-Source Voltage,(V)
8
Figure 8. Unclamped Inductive Switching Capability
10
1 Starting TJ=25
Starting TJ=150
0.1
0.01
1.E-06
1.E-05 1.E-04 1.E-03 1.E-02
tAV, Time in Avalanche(s)
1.E-01
12
11
10
9
8
7
6
5
4
3
2
0
Figure 9. Typical Drain-to-Source ON Resistance
VGS=10V
VGS=20V
2 46
ID, Drain Current(A)
8
Figure 10. Typical Drain-to-Source On Resistance
vs. Junction Temperature
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
-75 -50 -25 0 25 50 75 100 125 150
TJ, Junction Temperature ()
ARK Microelectronics Co., Ltd.
w w w. a r k - m i c r o. c o m
5/11
Rev. 2.0 Mar. 2009

5 Page





FTP02N60 arduino
FTP02N60/FTA02N60
Published by
ARK Microelectronics Co., Ltd.
No.9, East Zijing Road, High-tek District, Chengdu, P. R. China
All Rights Reserved.
Disclaimers
ARK Microelectronics Co., Ltd. reserves the right to make change without notice in order to improve
reliability, function or design and to discontinue any product or service without notice. Customers should obtain
the latest relevant information before orders and should verify that such information is current and complete. All
products are sold subject to ARK Microelectronics Co., Ltd’s terms and conditions supplied at the time of
order acknowledgement.
ARK Microelectronics Co., Ltd. warrants performance of its hardware products to the specifications at the
time of sale, Testing, reliability and quality control are used to the extent ARK Microelectronics Co., Ltd
deems necessary to support this warrantee. Except where agreed upon by contractual agreement, testing of all
parameters of each product is not necessary performed.
ARK Microelectronics Co., Ltd. does not assume any liability arising from the use of any product or circuit
designs described herein. Customers are responsible for their products and applications using ARK
Microelectronics Co., Ltd’s components. To minimize risk, customers must provide adequate design and
operating safeguards.
ARK Microelectronics Co., Ltd. does not warrant or convey any license either expressed or implied under its
patent rights, nor the rights of others. Reproduction of information in ARK Microelectronics Co., Ltd’s data
sheets or data books is permissible only if reproduction is without modification or alteration. Reproduction of this
information with any alteration is an unfair and deceptive business practice. ARK Microelectronics Co., Ltd is
not responsible or liable for such altered documentation.
Resale of ARK Microelectronics Co., Ltd’s products with statements different from or beyond the parameters
stated by ARK Microelectronics Co., Ltd. for the product or service voids all express or implied warrantees for
the associated ARK Microelectronics Co., Ltd’s product or service and is unfair and deceptive business
practice. ARK Microelectronics Co., Ltd is not responsible or liable for any such statements.
Life Support Policy:
ARK Microelectronics Co., Ltd’s products are not authorized for use as critical components in life devices or
systems without the expressed written approval of ARK Microelectronics Co., Ltd.
As used herein:
1. Life support devices or systems are devices or systems which:
a. are intended for surgical implant into the human body,
b. support or sustain life,
c. whose failure to perform when properly used in accordance with instructions for used provided in the
labeling, can be reasonably expected to result in significant injury to the user.
2. A critical component is any component is any component of a life support device or system whose failure
to perform can be reasonably expected to cause the failure of the life support device or system, or to affect
its safety or effectiveness.
ARK Microelectronics Co., Ltd.
w w w. a r k - m i c r o. c o m
11/11
Rev. 2.0 Mar. 2009

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