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PDF KLMCG8GEAC-B001 Data sheet ( Hoja de datos )

Número de pieza KLMCG8GEAC-B001
Descripción e.MMC
Fabricantes Samsung 
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No Preview Available ! KLMCG8GEAC-B001 Hoja de datos, Descripción, Manual

SAMSUNG CONFIDENTIAL
Rev. 1.0 Dec. 2012
KLMxGxGEAC-B001
Samsung e·MMC Product family
e.MMC 4.5 Specification compatibility
datasheet
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property
right is granted by one party to the other party under this document, by implication, estoppel or other-
wise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment, or
similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions
may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
All brand names, trademarks and registered trademarks belong to their respective owners.
2012 Samsung Electronics Co., Ltd. All rights reserved.
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KLMCG8GEAC-B001 pdf
KLMxGxGEAC-B001
datasheet
SAMSUNG CONFIDENTIAL
Rev. 1.0
e·MMC
INTRODUCTION
The SAMSUNG e·MMC is an embedded MMC solution designed in a BGA package form. e·MMC operation is identical to a MMC card and therefore is a
simple read and write to memory using MMC protocol v4.5 which is a industry standard.
e·MMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VDDF) whereas 1.8V or 3V dual supply voltage
(VDD) is supported for the MMC controller. Maximum MMC interface frequency of 200MHz and maximum bus widths of 8 bit are supported.
There are several advantages of using e·MMC. It is easy to use as the MMC interface allows easy integration with any microprocessor with MMC host.
Any revision or amendment of NAND is invisible to the host as the embedded MMC controller insulates NAND technology from the host. This leads to
faster product development as well as faster times to market.
The embedded flash mangement software or FTL(Flash Transition Layer) of e·MMC manages Wear Leveling, Bad Block Management and ECC. The
FTL supports all features of the Samsung NAND flash and achieves optimal performance.
1.0 PRODUCT LIST
[Table 1] Product List
Capacities e·MMC Part ID NAND Flash Type User Density (%)
Power System
Package size
Pin Configuration
8 GB
16 GB
32 GB
64 GB
KLM8G1GEAC-B001
KLMAG2GEAC-B001
KLMBG4GEAC-B001
KLMCG8GEAC-B001
64Gb x 1
64Gb x 2
64Gb x 4
64Gb x 8
91.0%
- Interface power : VDD
(1.70V ~ 1.95V or
2.7V ~ 3.6V)
- Memory power :
VDDF (2.7V ~ 3.6V)
11.5mm x 13mm x 1.0mm
11.5mm x 13mm x 1.2mm
153FBGA
2.0 KEY FEATURES
embeddedMultiMediaCard System Specification Ver. 4.5 compatible. Detail description is referenced by JEDEC Standard
SAMSUNG e·MMC supports new e·MMC4.5 features defined by JEDEC Standard
- Supported Features : Packed command, Cache, Discard, Sanitize, Power Off Notification, Data Tag,
Partition types, Context ID, Real Time Clock, Dynamic Device Capacity, HS200
- Non-supported Features : Large Sector Size (4KB)
Full backward compatibility with previous MultiMediaCard system specificataion (1bit data bus, multi-e·MMC systems)
Data bus width : 1bit (Default) , 4bit and 8bit
MMC I/F Clock Frequency : 0 ~ 200MHz
MMC I/F Boot Frequency : 0 ~ 52MHz
Temperature : Operation(-25C ~ 85C), Storage without operation (-40C ~ 85C)
Power : Interface power VDD (1.70V ~ 1.95V or 2.7V ~ 3.6V) , Memory power VDDF(2.7V ~ 3.6V)
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
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KLMCG8GEAC-B001 arduino
KLMxGxGEAC-B001
datasheet
SAMSUNG CONFIDENTIAL
Rev. 1.0
e·MMC
[Table 5] Definition of EXT_CSD value for Packed Command
Field
Definition
MAX_PACKED_READS
Max. number of commands that can be packed in the packed read command. Min. value is ‘5’
MAX_PACKED_WRITES
Max. number of commands that can be packed in the packed write command. Min. value is ‘3’
EXCEPTION_EVENTS_CTRL
Bit [15:4], Bit [0] : Reserved
Bit [3] : PACKED_EVENT_EN
Bit [2] : SYSPOOL_EVENT_EN
Bit [1] : DYNCAP_EVENT_EN
EXCEPTION_EVENTS_STATUS
Bit [15:4] : Reserved
Bit [3] : PACKED_FAILURE
(If this bit is set, the last packed command has failed. Host should check EXT_CSD field
PACKED_COMMAND_STATUS for the detailed cause.)
Bit [2] : SYSPOOL_EXHAUSTED
Bit [1] : DYNCAP_NEEDED
Bit [0] : URGENT_BKOPS
PACKED_COMMAND_STATUS
Status of the last packed command.
Bit [7:2] : Reserved
Bit [1] : Indexed Error, Bit [0] : Error
If any error occurs during packed command operation, the ‘Error bit’ (Bit 0) is set. If the error is a result of one of
the individual commands inside the packed command, its index is reported in PACKED_FAILURE_INDEX [35]
and ‘Indexed Error’ bit (bit 1) is set as well.
PACKED_FAILURE_INDEX
If the ‘Indexed Error’ bit (bit 1) in PACKED_COMMAND_STATUS is set, this field specifies the index in the
header of the failed command.
[Table 6] Packed command structure
Entry Index
-
1
2
3
Offset (Bytes)
+0
+1
+2
+3
+8
+12
+16
+20
+24
+28
+8N
N
+8N+4
- +8N+8
Name
VERSION
R/W
NUM_ENTRIES(=N)
padding to 8B
CMD23_ARG_1
CMDxx_ARG_1
CMD23_ARG_2
CMDxx_ARG_2
CMD23_ARG_3
CMDxx_ARG_3
---
CMD23_ARG_
CMDxx_ARG_1
Radding
Length (Bytes)
1
1
1
5
4
4
4
4
4
4
4
4
till block ends
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
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