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PDF YC-513HD Data sheet ( Hoja de datos )
| Número de pieza | YC-513HD | |
| Descripción | LED | |
| Fabricantes | PARKLANE | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de YC-513HD (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
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Part Number: YC-513HD
1.SPECIFICATIONS
Features:
Applications:
1.Low Power consumption
1.TV set
2.High efficiency
2.Monitor
3.Versatile mounting on P.C Board or panel
3.Telephone
4.Low current requirement
4.Computer
5.This product don't contained restriction substance, 5.Circuit board
compliance ROHS standard.
(1) Absolute Maximum Rating
Item Symbol
(Ta=25 )
Absolute Maximum Rating
Unit
Forward Current
IF
15 mA
Peak Forward Current
IFP
50
mA
Power Dissipation
PD
40 mW
Reverse Voltage
VR
5
V
Operating Temperature
TOP
-40 ~80
Storage Temperature
TSTG
-40 ~85
Lead Soldering Temperature TSOL
260 FOR 5 SECONDS
*1Condition for IFP is Pulse of 1/10 duty and 0.1msec width
(2) Initial Electrical/Optical Characteristics
(Ta=25 )
Item Symbol Condition Min Typ Max Unit
Forward Voltage
VF IF=20(mA) /
2.2 2.6
V
Reverse Current
IR VR=5(V)
/
/ 100 µA
Viewing Angle
2θ1/2 IF=20(mA) / 35 / deg
Spectral Line Half-width
IF=20(mA) / 90 / nm
Luminous Intensity
IV IF=20(mA) /
12.0
/
mcd
Peak Wavelength
λp IF=20(mA) / 700 /
nm
Remark:Viewing angle is the Off-axis angle at which the luminous intensity is half the
axial luminous intrnsity.
1 page  
Part Number: YC-513HD
5. Application Notes
(1)Lead Forming
When forming a lead should be bent at a point at least 3mm from the base of the
epoxy bulb .Do not use the base of the leadframe as a fulcrum during lead forming.
Lead forming should be done before soldering.
Do not apply any bending stress to the base of the lead .The stress to the base may
damage the LED’s characteristics or it may bread the LED.
When mounting the LED’s onto a printed circuit board, the holes on the circuit
board should be exactly aligned with the leads of the LED.
If the LED’s are mounted with stress at the leads, it causes deterioration of
epoxyresin and this will degrade the LED.
(2)Soldering conditions
Solder the LED’s no closer than 3mm from the base of the epoxy bulb. Soldering
the LED beyond the tie-bar is recommended.
Maximum allowable soldering conditions are;
Solder dipping: at 260 degrees C, 5seconds max
Solder iron: at 300 degrees C, 3seconds max
Do not apply any stress to the lead particularly when heated.
When it is necessary to clamp the LED to prevent soldering failure it is important
to minimize the mechanical stress on the LED’s.
Cut the LED leadframe at room temperature. Cutting the leadframes at high
temperature may cause failure of the LED.
(3)Static Electricity and Surge
Static electricity and surge will damage the LED. It is recommend to use a wrist
band or anti-electrostatic glove when handling the LED’s.
All devices, equipment and machinery must be properly grounded.
(4)Heat Generation
Heat generation must be taken into design consideration when using the LED’s.
The coefficient of temperature increase per input electric power at room
temperature is about 0.5 degrees C/mW at the LED’s active layer. This
temperature gets higher when the LED’s are densely mounted.
5 Page | ||
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| PDF Descargar | [ Datasheet YC-513HD.PDF ] | |
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