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PDF R213T3-L01 Data sheet ( Hoja de datos )
| Número de pieza | R213T3-L01 | |
| Descripción | TFT LCD Module | |
| Fabricantes | CHI MEI | |
| Logotipo |  |
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PRODUCT SPECIFICATION
Doc. Number: DN0281715
ϭ Tentative Specification
ϭ Preliminary Specification
Ϯ Approval Specification
MODEL NO.: R213T3
SUFFIX: L01
Customer:
APPROVED BY
SIGNATURE
Name / Title
Note
Please return 1 copy for your confirmation with your
signature and comments.
ுழၴʳ ຝ॰ʳ
2011-12-07 APPL
17:40:07 ʳ ขጥʳ
ᐉுʳ
ߡۥʳ ދปʳ
yuhsiang.chang Directorʳ Accept
(്/514-10922)
Version 2.2
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The copyright belongs to CHIMEI InnoLux. Any unauthorized use is prohibited.
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PRODUCT SPECIFICATION
1. GENERAL DESCRIPTION
1.1 OVERVIEW
R213T3-L01 is a 21.3” TFT Liquid Crystal Display module with 12 CCFLs Backlight unit and two port
31 pins 2ch-LVDS interface. This module supports 2560 x 2048 QSXGA screen and can display
monochrome driven by 8bit drivers. The LCD module includes built-in inverter for Backlight.
1.2 FEATURES
This specification applies to the Type 21.3” Mono TFT LCD Module, Model R213T3-L01- This module
includes an inverter card for the backlight.
- The screen format is intended to support QSXGA 2560(H) x 2048(V) resolution.
- Screen with sensor area (176(H) x 16(V)) at the top of the screen
- All input signals are LVDS (Low Voltage Differential Signaling) interface.
- This module is designed for a module with neutral white (0.294, 0.309) and DICOM gamma curve.
- This module is especially designed for wide view performance
- This module is UL approved and RoHs compliant
1.3 GENERAL SPECIFICATIONS
Item
Screen Size
Driver Element
Pixel Number
Pixel Pitch
Pixel Arrangement
Display Colors
Transmissive Mode
Surface Treatment
Luminance, White
Power Consumption
Specification
Unit
21.3” real diagonal
a-si TFT active matrix
-
2560(x3) x 2048
pixel
0.165 (H) x 0.165 (V)
mm
Sub-pixel Vertical stripe
-
8-bit per1(one) sub-pixel, grayscale
-
Dual domain IPS, Normally Black
-
AG type
-
1100
Cd/m2
Total 65.28W (typ.) @ cell 11.28 W (typ.), BL 54 W (typ.)
Note (1) The specified power consumption: Total= cell (reference 4.3.1)+ BL (reference 4.3.4)
Note
-
-
-
-
-
-
-
-
(1)
2. MECHANICAL SPECIFICATIONS
Item
Horizontal (H)
Module Size
Vertical (V)
Thickness (T)
Bezel Area
Horizontal
Vertical
Active Area
Horizontal
Vertical
Weight
Min.
459.3
374.8
48
426.1
344.0
-
-
2840
Typ.
459.8
375.3
48.5
426.4
344.5
422.4
337.92
2890
Max.
460.3
375.8
49
426.9
345.0
-
-
3010
Unit Note
mm
mm (1)
mm
mm
mm
mm
mm
g
Note (1) Please refer to the attached drawings for more information of front and back outline
dimensions.
Version 2.2
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PRODUCT SPECIFICATION
1,0 1,1 1,2 1,3
(e ve n) (odd ) (e ve n) (odd)
2,0 2,1
3,0
Pitch
1 ,X ma x
Pitch
Y ma x, 0
4.2.3 DC INPUT PIN ASSIGNMENT
Pin Name
1 GND
2 GND
3 GND
4 GND
5 Vcc
6 Vcc
7 Vcc
8 Vcc
Description
Ground for Vcc
Ground for Vcc
Ground for Vcc
Ground for Vcc
+12.0V Power Supply for Control board
+12.0V Power Supply for Control board
+12.0V Power Supply for Control board
+12.0V Power Supply for Control board
4.2.4 EDID INTERFACE PIN ASSIGNMENT
Pin Name
1 Vcc-EDID
2 NC
3 SCL
4 SDA
5 GND
Description
+3.3V Power Supply for EDID Chip
Not Connection
EDID Clock
EDID Data
Ground for Vcc-EDID
Y m ax ,
Xmax
Version 2.2
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